Growth Characteristics and Film Properties of Cerium Dioxide Prepared by Plasma-Enhanced Atomic Layer Deposition
Type:
Journal
Info:
Journal of The Electrochemical Society, 158 (8) G169-G172 (2011)
Date:
2011-06-01
Author Information
Name | Institution |
---|---|
Woo-Hee Kim | Yonsei University |
Min-Kyu Kim | Yonsei University |
Wan Joo Maeng | Samsung Electronics Co. |
Julien Gatineau | Air Liquide |
Venkat Pallem | Air Liquide |
Christian Dussarrat | Air Liquide |
Atif Noori | Applied Materials |
David Thompson | Applied Materials |
Schubert Chu | Applied Materials |
Hyungjun Kim | Yonsei University |
Films
Plasma CeO2
Film/Plasma Properties
Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Interface State Density
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Hysteresis
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Dielectric Constant, Permittivity
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Effective Oxide Charge, Qeff
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Flat Band Voltage
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Characteristic: Evaporation Characteristics
Analysis: TGA, Thermo Gravimetric Analysis
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Refractive Index
Analysis: Ellipsometry
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Substrates
Si(100) |
Notes
Films underwent O2 anneal. |
Substrates RCA cleaned + HF dipped. |
37 |