About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Performance and retention characteristics of nanocrystalline Si floating gate memory with an Al2O3 tunnel layer fabricated by plasma-enhanced atomic layer deposition

Type:
Journal
Info:
Journal of Applied Physics 119, 075702 (2016)
Date:
2016-01-17

Author Information

Name Institution
Zhongyuan MaNanjing University
Wen WangNanjing University
Huafeng YangNanjing University
Xiaofan JiangNanjing University
Jie YuNanjing University
Hua QinChinese Academy of Sciences
Ling XuNanjing University
Kunji ChenNanjing University
Xinfan HuangNanjing University
Wei LiNanjing University
Jun XuNanjing University
Duan FengNanjing University

Films

Plasma Al2O3


Film/Plasma Properties

Characteristic: Thickness
Analysis: -

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope

Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Hysteresis
Analysis: C-V, Capacitance-Voltage Measurements

Substrates

Notes

769