Oxygen migration in TiO2-based higher-k gate stacks
Type:
Journal
Info:
Journal of Applied Physics 107, 054102 (2010)
Date:
2009-12-29
Author Information
Name | Institution |
---|---|
Sang Bum Kim | IBM |
Stephen L. Brown | IBM |
S. M. Rossnagel | IBM |
John Bruley | IBM |
Matthew Copel | IBM |
Marco J. P. Hopstaken | IBM |
Vijay Narayanan | IBM |
Martin M. Frank | IBM |
Films
Film/Plasma Properties
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: FTIR, Fourier Transform InfraRed spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: MEIS, Medium Energy Ion Scattering
Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: CET, capacitance equivalent thickness
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Characteristic: Chemical Composition, Impurities
Analysis: ELS, EELS, Electron Energy Loss Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: SIMS, Secondary Ion Mass Spectrometry
Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Characteristic: Interfacial Layer
Analysis: TEM, Transmission Electron Microscope
Substrates
Si(100) |
Notes
726 |