
Influence of Atomic Layer Deposition Temperatures on TiO2/n-Si MOS Capacitor
Type:
Journal
Info:
ECS J. Solid State Sci. Technol. 2013 volume 2, issue 5, N110-N114
Date:
2013-02-25
Author Information
| Name | Institution |
|---|---|
| Daming Wei | Kansas State University |
| T. Hossain | Kansas State University |
| Nelson Y. Garces | U.S. Naval Research Laboratory |
| Neeraj Nepal | U.S. Naval Research Laboratory |
| H. M. Meyer III | Oak Ridge National Laboratory |
| M. J. Kirkham | Oak Ridge National Laboratory |
| Charles R. Eddy, Jr. | U.S. Naval Research Laboratory |
| J. H. Edgar | Kansas State University |
Films
Plasma TiO2
Film/Plasma Properties
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Refractive Index
Analysis: Ellipsometry
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Hysteresis
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Interface Trap Density
Analysis: C-V, Capacitance-Voltage Measurements
Substrates
| Si(100) |
Notes
| 597 |
