Compositional Depth Profiling Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Compositional Depth Profiling returned 66 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

Number	Title
1	A comparison between HfO2/Al2O3 nano-laminates and ternary HfxAlyO compound as the dielectric material in InGaAs based metal-oxide-semiconductor (MOS) capacitors
2	A comparison between remote plasma-enhanced and thermal ALD of Hafnium-nitride thin films
3	Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM
4	AlN passivation by plasma-enhanced atomic layer deposition for GaN-based power switches and power amplifiers
5	Atomic layer deposition of AlN from AlCl3 using NH3 and Ar/NH3 plasma
6	Atomic layer deposition of B2O3/SiO2 thin films and their application in an efficient diffusion doping process
7	Atomic Layer Deposition of High-Purity Palladium Films from Pd(hfac)2 and H2 and O2 Plasmas
8	Atomic layer deposition of titanium nitride from TDMAT precursor
9	Atomic Layer Deposition of Wet-Etch Resistant Silicon Nitride Using Di(sec-butylamino)silane and N2 Plasma on Planar and 3D Substrate Topographies
10	Barrier Characteristics of ZrN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Using Tetrakis(diethylamino)zirconium Precursor
11	Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes
12	Characteristics of Cobalt Thin Films Deposited by Remote Plasma ALD Method with Dicobalt Octacarbonyl
13	Characteristics of HfN films deposited by using remote plasma-enhanced atomic layer deposition
14	Characteristics of Nickel Thin Film and Formation of Nickel Silicide by Remote Plasma Atomic Layer Deposition using Ni(iPr-DAD)2
15	Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method
16	Characteristics of ZrO2 gate dielectric deposited using Zr(t –butoxide) and Zr(NEt2)4 precursors by plasma enhanced atomic layer deposition method
17	Characterization of hafnium oxide resistive memory layers deposited on copper by atomic layer deposition
18	Characterization of HfOxNy thin film formation by in-situ plasma enhanced atomic layer deposition using NH3 and N2 plasmas
19	Comparison between ZnO films grown by plasma-assisted atomic layer deposition using H2O plasma and O2 plasma as oxidant
20	Degradation of the surface passivation of plasma-assisted ALD Al2O3 under damp-heat exposure
21	Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
22	Effect of Crystal Structure and Grain Size on Photo-Catalytic Activities of Remote-Plasma Atomic Layer Deposited Titanium Oxide Thin Film
23	Effect of postdeposition annealing on the electrical properties of beta-Ga2O3 thin films grown on p-Si by plasma-enhanced atomic layer deposition
24	Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
25	Electrical Properties of Al2O3 Films Grown by the Electron Cyclotron Resonance Plasma-Enhanced Atomic Layer Deposition (ECR-PEALD) and Thermal ALD Methods
26	Electron Enhanced Growth of Crystalline Gallium Nitride Thin Films at Room Temperature and 100°C Using Sequential Surface Reactions
27	Electronic properties of atomic-layer-deposited high-k dielectrics on GaSb(001) with hydrogen plasma pretreatment
28	Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics
29	Examining the role of hydrogen in the electrical performance of in situ fabricated metal-insulator-metal trilayers using an atomic layer deposited Al2O3 dielectric
30	Excellent resistive switching properties of atomic layer-deposited Al2O3/HfO2/Al2O3 trilayer structures for non-volatile memory applications
31	Fully CMOS-compatible titanium nitride nanoantennas
32	Gadolinium nitride films deposited using a PEALD based process
33	GaN metal-insulator-semiconductor high-electron-mobility transistor with plasma enhanced atomic layer deposited AlN as gate dielectric and passivation
34	Hydrogen induced passivation of Si interfaces by Al2O3 films and SiO2/Al2O3 stacks
35	Impact of nitrogen depth profiles on the electrical properties of crystalline high-K gate dielectrics
36	Interface Properties of Nickel-silicide Films Deposited by Using Plasma-assisted Atomic Layer Deposition
37	Long-term ambient surface oxidation of titanium oxynitride films prepared by plasma-enhanced atomic layer deposition: An XPS study
38	Low temperature SiOx thin film deposited by plasma enhanced atomic layer deposition for thin film encapsulation applications
39	Low temperature thin film transistors with hollow cathode plasma-assisted atomic layer deposition based GaN channels
40	Low-Temperature Deposition of Hexagonal Boron Nitride Via Sequential Injection of Triethylboron and N2/H2 Plasma
41	Optical and Electrical Properties of AlxTi1-xO Films
42	Oxide Charge Engineering of Atomic Layer Deposited AlOxNy/Al2O3 Gate Dielectrics: A Path to Enhancement Mode GaN Devices
43	Passivation of InGaAs interface states by thin AlN interface layers for metal-insulator-semiconductor applications
44	Photoelectrochemical hydrogen production on silicon microwire arrays overlaid with ultrathin titanium nitride
45	Plasma enhanced atomic layer batch processing of aluminum doped titanium dioxide
46	Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
47	Plasma nitridation of atomic layer deposition (ALD) Al2O3 by NH3 in plasma-enhanced chemical vapor deposition (PECVD) for silicon solar cell
48	Plasma-assisted atomic layer deposition of Al2O3 and parylene C bi-layer encapsulation for chronic implantable electronics
49	Plasma-enhanced ALD system for SRF cavity
50	Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating
51	Plasma-enhanced atomic layer deposition of nickel thin film using bis(1,4-diisopropyl-1,4-diazabutadiene)nickel
52	Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
53	Pt/Ta2O5/HfO2-x/Ti Resistive Switching Memory Competing with Multilevel NAND Flash
54	Pulse plasma assisted atomic layer deposition of W–C–N thin films for Cu interconnects
55	Radio frequency plasma power dependence of the moisture permeation barrier characteristics of Al2O3 films deposited by remote plasma atomic layer deposition
56	Self-limiting growth of GaN using plasma-enhanced atomic layer deposition
57	TaN interface properties and electric field cycling effects on ferroelectric Si-doped HfO2 thin films
58	The effects of layering in ferroelectric Si-doped HfO2 thin films
59	The Formation of an Almost Full Atomic Monolayer via Surface Modification by N2O-Plasma in Atomic Layer Deposition of ZrO2 Thin Films
60	The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
61	The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
62	Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
63	Tunable Work-Function Engineering of TiC-TiN Compound by Atomic Layer Deposition for Metal Gate Applications
64	Ultra-Thin Aluminium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition for Corrosion Protection
65	Use of B2O3 films grown by plasma-assisted atomic layer deposition for shallow boron doping in silicon
66	Using top graphene layer as sacrificial protection during dielectric atomic layer deposition

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I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. If you know of publications I have missed or a database entry is wrong, send me an email at: marksowa@plasma-ald.com

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