Publication Information

Title:
Low temperature SiOx thin film deposited by plasma enhanced atomic layer deposition for thin film encapsulation applications
Type:
Journal
Info:
Journal of Vacuum Science & Technology A 35, 041508 (2017)
Date:
2017-05-25

Author Information

Name Institution
Young-Soo LeeHanyang University
Ju-Hwan HanHanyang University
Jin-Seong ParkHanyang University
Jozeph ParkKorea Advanced Institute of Science and Technology

Films

Plasma SiO2


Film/Plasma Properties

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity

Characteristic: Morphology, Roughness, Topography
Analysis: XRR, X-Ray Reflectivity

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Calcium Test

Characteristic: Chemical Binding
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Refractive Index
Analysis: Ellipsometry

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Breakdown Voltage
Analysis: I-V, Current-Voltage Measurements

Substrates

Si(100)
Glass

Keywords

Encapsulation
Diffusion Barrier

Notes

1095