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Low temperature SiOx thin film deposited by plasma enhanced atomic layer deposition for thin film encapsulation applications
Type:
Journal
Info:
Journal of Vacuum Science & Technology A 35, 041508 (2017)
Date:
2017-05-25
Author Information
| Name | Institution |
|---|---|
| Young-Soo Lee | Hanyang University |
| Ju-Hwan Han | Hanyang University |
| Jin-Seong Park | Hanyang University |
| Jozeph Park | Korea Advanced Institute of Science and Technology |
Films
Plasma SiO2
Film/Plasma Properties
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Morphology, Roughness, Topography
Analysis: XRR, X-Ray Reflectivity
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Calcium Test
Characteristic: Chemical Binding
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Refractive Index
Analysis: Ellipsometry
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Breakdown Voltage
Analysis: I-V, Current-Voltage Measurements
Substrates
| Si(100) |
| Glass |
Notes
| 1095 |