Thermal Stability of ALD HfO2 Thin Films and Interfacial Layers on the Oxynitride Underlayer Formed Using Remote Plasma
Type:
Journal
Info:
Electrochemical and Solid-State Letters, 9 (2) G40-G43 (2006)
Date:
2005-09-23
Author Information
Name | Institution |
---|---|
Seokhoon Kim | Hanyang University |
Ju Youn Kim | Samsung Electronics Co. |
Jinwoo Kim | Hanyang University |
Jihoon Choi | Hanyang University |
Hyunseok Kang | Hanyang University |
Choelhwyi Bae | Samsung Electronics Co. |
Hyeongtag Jeon | Hanyang University |
Films
Plasma HfO2
Film/Plasma Properties
Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Electron Density, ne
Analysis: Cut-off Method
Characteristic: Plasma Species
Analysis: OES, Optical Emission Spectroscopy
Characteristic: Ion Density
Analysis: Langmuir Probe
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Interfacial Layer
Analysis: TEM, Transmission Electron Microscope
Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Characteristic: EOT, Equivalent Oxide Thickness
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Fixed Charge Density
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Trapped Positive Charge-Density Change
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Substrates
Silicon |
Notes
1317 |