Thermal Stability of ALD HfO2 Thin Films and Interfacial Layers on the Oxynitride Underlayer Formed Using Remote Plasma

Type:
Journal
Info:
Electrochemical and Solid-State Letters, 9 (2) G40-G43 (2006)
Date:
2005-09-23

Author Information

Name Institution
Seokhoon KimHanyang University
Ju Youn KimSamsung Electronics Co.
Jinwoo KimHanyang University
Jihoon ChoiHanyang University
Hyunseok KangHanyang University
Choelhwyi BaeSamsung Electronics Co.
Hyeongtag JeonHanyang University

Films


Film/Plasma Properties

Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Electron Density, ne
Analysis: Cut-off Method

Characteristic: Plasma Species
Analysis: OES, Optical Emission Spectroscopy

Characteristic: Ion Density
Analysis: Langmuir Probe

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Interfacial Layer
Analysis: TEM, Transmission Electron Microscope

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope

Characteristic: EOT, Equivalent Oxide Thickness
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Fixed Charge Density
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Trapped Positive Charge-Density Change
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements

Substrates

Silicon

Notes

1317