About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Effect of Crystal Structure and Grain Size on Photo-Catalytic Activities of Remote-Plasma Atomic Layer Deposited Titanium Oxide Thin Film

Type:
Journal
Info:
ECS J. Solid State Sci. Technol. 2012 volume 1, issue 4, Q63-Q69
Date:
2012-07-02

Author Information

Name Institution
Jaesang LeeHanyang University
Seung Jae LeeHanyang University
Won Bae HanHanyang University
Heeyoung JeonHanyang University
Jingyu ParkHanyang University
Hyungjun KimHanyang University
Chong Seung YoonHanyang University
Hyeongtag JeonHanyang University

Films

Plasma TiO2


Film/Plasma Properties

Characteristic: Photocatalytic Activity
Analysis: Custom

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Substrates

Si(100)

Notes

641