Publication Information

Title: Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating

Type: Journal

Info: Surface and Coatings Technology, Volume 259, Part A, 25 November 2014, Pages 98-101

Date: 2014-05-15

DOI: http://dx.doi.org/10.1016/j.surfcoat.2014.05.005

Author Information

Name

Institution

Hanyang University

Films

Plasma Co using Custom

Deposition Temperature Range = 120-200C

56792-69-9

1333-74-0

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Compositional Depth Profiling

AES, Auger Electron Spectroscopy

PHI 680 FEAES

Thickness

TEM, Transmission Electron Microscope

Hitachi HD-2300A

Wetting Angle

Contact Angle Measurement

-

Wetting Angle

Sessile Drop Tests

-

Morphology, Roughness, Topography

AFM, Atomic Force Microscopy

-

Substrates

TaN

Keywords

Copper Electroplating

Interconnect

Metallic Thin Films

Notes

PEALD Co for copper interconnect plating.

278



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