Publication Information

Title:
Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating
Type:
Journal
Info:
Surface and Coatings Technology, Volume 259, Part A, 25 November 2014, Pages 98-101
Date:
2014-05-15

Author Information

Name Institution
Jae-Hyung ParkHanyang University

Films

Plasma Co


Film/Plasma Properties

Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope

Characteristic: Wetting Angle
Analysis: Contact Angle Measurement

Characteristic: Wetting Angle
Analysis: Sessile Drop Tests

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Substrates

TaN

Keywords

Copper Electroplating
Interconnect
Metallic Thin Films

Notes

PEALD Co for copper interconnect plating.
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