About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Boosting n-Type Doping Levels of Ge With Co-Doping by Integrating Plasma-Assisted Atomic Layer Deposition and Flash Annealing Process

Type:
Journal
Info:
IEEE ELECTRON DEVICE LETTERS, VOL. 40, NO. 9, PP. 1507--1510, 2019
Date:
2019-07-23

Author Information

Name Institution
Seunghun BaikDaegu Gyeongbuk Institute of Science & Technology
Hyeokjin KwonDaegu Gyeongbuk Institute of Science & Technology
Chuck PaengLam Research Corporation
He ZhangLam Research Corporation
Bodo KalkofenOtto-von-Guericke University
Jae Eun JangDaegu Gyeongbuk Institute of Science & Technology
Y. S. KimLam Research Corporation
Hyuk-Jun KwonDaegu Gyeongbuk Institute of Science & Technology

Films

Plasma POx

Hardware used: Unknown


Plasma Sb2O5

Hardware used: Unknown


Plasma SiO2

Hardware used: Unknown


Film/Plasma Properties

Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy

Substrates

Notes

1475