2021 Year in Review

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Tailoring angular selectivity in SiO₂ slanted columnar thin films using atomic layer deposition of titanium nitride Characterization of Molybdenum Oxide Thin Films Grown by Atomic Layer Deposition Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition

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202 Films Compositions

272 Precursors and Plasma Gases

77 Deposition Hardwares

250 Film and Plasma Characteristics

Conformality, Step Coverage Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Conformality, Step Coverage returned 120 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

Number	Title
1	A PEALD Tunnel Dielectric for Three-Dimensional Non-Volatile Charge-Trapping Technology
2	A rotary reactor for thermal and plasma-enhanced atomic layer deposition on powders and small objects
3	Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM
4	Advanced thin conformal Al₂O₃ films for high aspect ratio mercury cadmium telluride sensors
5	ALD titanium nitride coated carbon nanotube electrodes for electrochemical supercapacitors
6	ALD titanium nitride on vertically aligned carbon nanotube forests for electrochemical supercapacitors
7	An Analysis of the Deposition Mechanisms involved during Self-Limiting Growth of Aluminum Oxide by Pulsed PECVD
8	Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
9	Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
10	Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
11	Atomic layer deposition of aluminum fluoride using Al(CH₃)₃ and SF₆ plasma
12	Atomic Layer Deposition of Aluminum Nitride Thin films from Trimethyl Aluminum (TMA) and Ammonia
13	Atomic Layer Deposition of Aluminum Phosphate Using AlMe₃, PO(OMe)₃, and O₂ Plasma: Film Growth and Surface Reactions
14	Atomic layer deposition of aluminum thin films using an alternating supply of trimethylaluminum and a hydrogen plasma
15	Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
16	Atomic layer deposition of HfO₂ using HfCp(NMe₂)₃ and O₂ plasma
17	Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide
18	Atomic Layer Deposition of TiN/Al₂O₃/TiN Nanolaminates for Capacitor Applications
19	Atomic Layer Deposition of Wet-Etch Resistant Silicon Nitride Using Di(sec-butylamino)silane and N₂ Plasma on Planar and 3D Substrate Topographies
20	Atomic layer deposition of WN_x thin films using a F-free tungsten metal-organic precursor and NH₃ plasma as a Cu-diffusion barrier
21	Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
22	Boosting n-Type Doping Levels of Ge With Co-Doping by Integrating Plasma-Assisted Atomic Layer Deposition and Flash Annealing Process
23	Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes
24	Characteristics of HfN films deposited by using remote plasma-enhanced atomic layer deposition
25	Characteristics of NiO films prepared by atomic layer deposition using bis(ethylcyclopentadienyl)-Ni and O₂ plasma
26	Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method
27	Characteristics of Tungsten Carbide Films Prepared by Plasma-Assisted ALD Using Bis(tert-butylimido)bis(dimethylamido)tungsten
28	Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
29	Chemically conformal deposition of SrTiO₃ thin films by Atomic Layer Deposition using conventional metal organic precursors and remote-plasma activated H₂O
30	Comparative study on growth characteristics and electrical properties of ZrO₂ films grown using pulsed plasma-enhanced chemical vapor deposition and plasma-enhanced atomic layer deposition for oxide thin film transistors
31	Conformality of Al₂O₃ and AlN Deposited by Plasma-Enhanced Atomic Layer Deposition
32	Conformality of remote plasma-enhanced atomic layer deposition processes: An experimental study
33	Copper-ALD Seed Layer as an Enabler for Device Scaling
34	Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
35	Development of Space Divided PE-ALD System and Process Design for Gap-Fill Process in Advanced Memory Devices
36	Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
37	Effect of anode morphology on the performance of thin film solid oxide fuel cell with PEALD YSZ electrolyte
38	Electrical properties of Ga₂O₃-based dielectric thin films prepared by plasma enhanced atomic layer deposition (PEALD)
39	Electrical properties of SrTa₂O₆ thin films by plasma enhanced atomic layer deposition (PEALD)
40	Evaluation of Low Temperature Silicon Nitride Spacer for High-k Metal Gate Integration
41	Film Conformality and Extracted Recombination Probabilities of O Atoms during Plasma-Assisted Atomic Layer Deposition of SiO₂, TiO₂, Al₂O₃, and HfO₂
42	Growth behavior and structural characteristics of TiO₂ thin films using (CpN)Ti(NMe₂)₂ and oxygen remote plasma
43	Growth kinetics and initial stage growth during plasma-enhanced Ti atomic layer deposition
44	Growth of amorphous zinc tin oxide films using plasma-enhanced atomic layer deposition from bis(1-dimethylamino-2-methyl-2propoxy)tin, diethylzinc, and oxygen plasma
45	Growth of controllable ZnO film by atomic layer deposition technique via inductively coupled plasma treatment
46	High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
47	Highly Conductive HfN_x Films Prepared by Plasma-Assisted Atomic Layer Deposition
48	Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu
49	Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition
50	Hot-wire-assisted atomic layer deposition of a high quality cobalt film using cobaltocene: Elementary reaction analysis on NH_x radical formation
51	Hydrogen plasma-enhanced atomic layer deposition of copper thin films
52	Impact of Plasma-Assisted Atomic-Layer-Deposited Gate Dielectric on Graphene Transistors
53	Improvement of smooth surface of RuO₂ bottom electrode on Al₂O₃ buffer layer and characteristics of RuO₂/TiO₂/Al₂O₃/TiO₂/RuO₂ capacitors
54	In situ dry cleaning of Si wafer using OF₂/NH₃ remote plasma with low global warming potential
55	Initial growth, refractive index, and crystallinity of thermal and plasma-enhanced atomic layer deposition AlN films
56	Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
57	Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
58	Investigation of Tungsten Nitride Deposition Using Tungsten Hexafluoride Precursor for Via and Plug Metallization
59	Large-area plasmonic hot-spot arrays: sub-2 nm interparticle separations with plasma-enhanced atomic layer deposition of Ag on periodic arrays of Si nanopillars
60	Low Temperature Atomic Layer Deposition of Crystalline In₂O₃ Films
61	Low-impurity, highly conformal atomic layer deposition of titanium nitride using NH₃-Ar-H₂ plasma treatment for capacitor electrodes
62	Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
63	Low-temperature atomic layer deposition of TiO₂, Al₂O₃,and ZnO thin films
64	Low-temperature direct synthesis of high quality WS₂ thin films by plasma-enhanced atomic layer deposition for energy related applications
65	Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient
66	Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
67	Nanometer-Thick Conformal Pore Sealing of Self-Assembled Mesoporous Silica by Plasma-Assisted Atomic Layer Deposition
68	NiCO₂O₄@TiN Core-shell Electrodes through Conformal Atomic Layer Deposition for All-solid-state Supercapacitors
69	Plasma Enhanced Atomic Layer Deposition of Al₂O₃ and TiN
70	Plasma enhanced atomic layer deposition of aluminum sulfide thin films
71	Plasma enhanced atomic layer deposition of Ga₂O₃ thin films
72	Plasma enhanced atomic layer deposition of gallium sulfide thin films
73	Plasma enhanced atomic layer deposition of SiN_x:H and SiO₂
74	Plasma Enhanced Atomic Layer Deposition of SiO₂ Using Space-Divided Plasma System
75	Plasma enhanced atomic layer deposition of SrTiO₃ thin films with Sr(tmhd)₂ and Ti(i-OPr)₄
76	Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
77	Plasma enhanced atomic layer deposition of zinc sulfide thin films
78	Plasma Enhanced Atomic Layer Deposition on Powders
79	Plasma-Assisted ALD for the Conformal Deposition of SiO₂: Process, Material and Electronic Properties
80	Plasma-Assisted ALD of LiPO(N) for Solid State Batteries
81	Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors
82	Plasma-assisted atomic layer deposition of conformal Pt films in high aspect ratio trenches
83	Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications
84	Plasma-assisted atomic layer deposition of TiN monitored by in situ spectroscopic ellipsometry
85	Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)
86	Plasma-Enhanced Atomic Layer Deposition of Anatase TiO₂ Using TiCl₄
87	Plasma-Enhanced Atomic Layer Deposition of Iron Phosphate as a Positive Electrode for 3D Lithium-Ion Microbatteries
88	Plasma-Enhanced Atomic Layer Deposition of Nickel Nanotubes with Low Resistivity and Coherent Magnetization Dynamics for 3D Spintronics
89	Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride Using a Novel Silylamine Precursor
90	Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers
91	Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
92	Plasma-enhanced atomic layer deposition of TiC_x films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
93	Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures
94	Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
95	Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
96	Radical Enhanced Atomic Layer Deposition of Tantalum Oxide - Thesis Coverage
97	Radical Enhanced Atomic Layer Deposition of Titanium Dioxide
98	Radical Enhanced Atomic Layer Deposition of Titanium Dioxide - Thesis Coverage
99	Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
100	Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates
101	Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates - Thesis Coverage
102	Radical-enhanced atomic layer deposition of Y₂O₃ via a beta-diketonate precursor and O radicals
103	Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
104	Remote Plasma Atomic Layer Deposition of SiN_x Using Cyclosilazane and H₂/N₂ Plasma
105	Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
106	Robust TaN_x diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
107	Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
108	Selective composition modification deposition utilizing ion bombardment-induced interfacial mixing during plasma-enhanced atomic layer deposition
109	Structural, electrical, and optical properties of transparent gallium oxide thin films grown by plasma-enhanced atomic layer deposition
110	Study on the characteristics of aluminum thin films prepared by atomic layer deposition
111	Tailoring angular selectivity in SiO₂ slanted columnar thin films using atomic layer deposition of titanium nitride
112	Temperature controlled Ru and RuO₂ growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)₂
113	The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
114	Thermal and plasma enhanced atomic layer deposition of SiO₂ using commercial silicon precursors
115	Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality
116	Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
117	Topographically selective deposition
118	Tuning Material Properties of Oxides and Nitrides by Substrate Biasing during Plasma-Enhanced Atomic Layer Deposition on Planar and 3D Substrate Topographies
119	Ultra-Thin Aluminium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition for Corrosion Protection
120	Very high frequency plasma reactant for atomic layer deposition