Conformality, Step Coverage Plasma Enhanced Atomic Layer Deposition Publications

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NumberTitle
1Electrical properties of SrTa2O6 thin films by plasma enhanced atomic layer deposition (PEALD)
2Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
3Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors
4Hot-wire-assisted atomic layer deposition of a high quality cobalt film using cobaltocene: Elementary reaction analysis on NHx radical formation
5Hydrogen plasma-enhanced atomic layer deposition of copper thin films
6Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality
7Radical-enhanced atomic layer deposition of Y2O3 via a beta-diketonate precursor and O radicals
8Atomic Layer Deposition of Aluminum Phosphate Using AlMe3, PO(OMe)3, and O2 Plasma: Film Growth and Surface Reactions
9Remote Plasma Atomic Layer Deposition of SiNx Using Cyclosilazane and H2/N2 Plasma
10Film Conformality and Extracted Recombination Probabilities of O Atoms during Plasma-Assisted Atomic Layer Deposition of SiO2, TiO2, Al2O3, and HfO2
11Radical Enhanced Atomic Layer Deposition of Tantalum Oxide - Thesis Coverage
12Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
13Plasma-Enhanced Atomic Layer Deposition of Iron Phosphate as a Positive Electrode for 3D Lithium-Ion Microbatteries
14Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
15Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
16Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
17Characteristics of HfN films deposited by using remote plasma-enhanced atomic layer deposition
18ALD titanium nitride coated carbon nanotube electrodes for electrochemical supercapacitors
19Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates - Thesis Coverage
20Conformality of remote plasma-enhanced atomic layer deposition processes: An experimental study
21Engineering high quality and conformal ultrathin SiNx films by PEALD for downscaled and advanced CMOS nodes
22Chemically conformal deposition of SrTiO3 thin films by Atomic Layer Deposition using conventional metal organic precursors and remote-plasma activated H2O
23Effect of anode morphology on the performance of thin film solid oxide fuel cell with PEALD YSZ electrolyte
24Tailoring angular selectivity in SiO2 slanted columnar thin films using atomic layer deposition of titanium nitride
25Plasma-Enhanced Atomic Layer Deposition of Anatase TiO2 Using TiCl4
26Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride Using a Novel Silylamine Precursor
27Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
28Atomic layer deposition of HfO2 using HfCp(NMe2)3 and O2 plasma
29Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient
30Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
31Structural, electrical, and optical properties of transparent gallium oxide thin films grown by plasma-enhanced atomic layer deposition
32The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
33Radical Enhanced Atomic Layer Deposition of Titanium Dioxide - Thesis Coverage
34Study on the characteristics of aluminum thin films prepared by atomic layer deposition
35Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM
36Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
37Nanometer-Thick Conformal Pore Sealing of Self-Assembled Mesoporous Silica by Plasma-Assisted Atomic Layer Deposition
38Comparative study on growth characteristics and electrical properties of ZrO2 films grown using pulsed plasma-enhanced chemical vapor deposition and plasma-enhanced atomic layer deposition for oxide thin film transistors
39Atomic layer deposition of aluminum fluoride using Al(CH3)3 and SF6 plasma
40Characteristics of NiO films prepared by atomic layer deposition using bis(ethylcyclopentadienyl)-Ni and O2 plasma
41Copper-ALD Seed Layer as an Enabler for Device Scaling
42Ultra-Thin Aluminium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition for Corrosion Protection
43In situ dry cleaning of Si wafer using OF2/NH3 remote plasma with low global warming potential
44Characteristics of Tungsten Carbide Films Prepared by Plasma-Assisted ALD Using Bis(tert-butylimido)bis(dimethylamido)tungsten
45Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition
46Investigation of Tungsten Nitride Deposition Using Tungsten Hexafluoride Precursor for Via and Plug Metallization
47Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors
48Ion energy control and its applicability to plasma enhanced atomic layer deposition for synthesizing titanium dioxide films
49Plasma-assisted atomic layer deposition of TiN monitored by in situ spectroscopic ellipsometry
50Plasma enhanced atomic layer deposition of SrTiO3 thin films with Sr(tmhd)2 and Ti(i-OPr)4
51Plasma enhanced atomic layer deposition of gallium sulfide thin films
52Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers
53High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
54Very high frequency plasma reactant for atomic layer deposition
55Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
56Plasma enhanced atomic layer deposition of aluminum sulfide thin films
57Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
58Large-area plasmonic hot-spot arrays: sub-2 nm interparticle separations with plasma-enhanced atomic layer deposition of Ag on periodic arrays of Si nanopillars
59Growth of amorphous zinc tin oxide films using plasma-enhanced atomic layer deposition from bis(1-dimethylamino-2-methyl-2propoxy)tin, diethylzinc, and oxygen plasma
60Conformality of Al2O3 and AlN Deposited by Plasma-Enhanced Atomic Layer Deposition
61Tuning Material Properties of Oxides and Nitrides by Substrate Biasing during Plasma-Enhanced Atomic Layer Deposition on Planar and 3D Substrate Topographies
62Low-temperature atomic layer deposition of TiO2, Al2O3,and ZnO thin films
63Topographically selective deposition
64Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
65Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
66Plasma-Assisted ALD for the Conformal Deposition of SiO2: Process, Material and Electronic Properties
67Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method
68Plasma-assisted atomic layer deposition of conformal Pt films in high aspect ratio trenches
69Selective composition modification deposition utilizing ion bombardment-induced interfacial mixing during plasma-enhanced atomic layer deposition
70Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu
71Radical Enhanced Atomic Layer Deposition of Titanium Dioxide
72Plasma enhanced atomic layer deposition of SiNx:H and SiO2
73Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures
74Plasma Enhanced Atomic Layer Deposition on Powders
75Impact of Plasma-Assisted Atomic-Layer-Deposited Gate Dielectric on Graphene Transistors
76Electrical properties of Ga2O3-based dielectric thin films prepared by plasma enhanced atomic layer deposition (PEALD)
77Growth kinetics and initial stage growth during plasma-enhanced Ti atomic layer deposition
78Plasma-Enhanced Atomic Layer Deposition of Nickel Nanotubes with Low Resistivity and Coherent Magnetization Dynamics for 3D Spintronics
79Ion energy control during plasma-enhanced atomic layer deposition: enabling materials control and selective processing in the third dimension
80Plasma Enhanced Atomic Layer Deposition of Al2O3 and TiN
81Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)
82Low-impurity, highly conformal atomic layer deposition of titanium nitride using NH3-Ar-H2 plasma treatment for capacitor electrodes
83Plasma enhanced atomic layer deposition of zinc sulfide thin films
84Low Temperature Atomic Layer Deposition of Crystalline In2O3 Films
85Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
86Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
87Boosting n-Type Doping Levels of Ge With Co-Doping by Integrating Plasma-Assisted Atomic Layer Deposition and Flash Annealing Process
88Low-temperature direct synthesis of high quality WS2 thin films by plasma-enhanced atomic layer deposition for energy related applications
89Atomic layer deposition of aluminum thin films using an alternating supply of trimethylaluminum and a hydrogen plasma
90Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates
91Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
92Atomic Layer Deposition of TiN/Al2O3/TiN Nanolaminates for Capacitor Applications
93A rotary reactor for thermal and plasma-enhanced atomic layer deposition on powders and small objects
94Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
95Uniformity of HfO2 Thin Films Prepared on Trench Structures via Plasma-Enhanced Atomic Layer Deposition
96Development of Space Divided PE-ALD System and Process Design for Gap-Fill Process in Advanced Memory Devices
97Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes
98Growth of controllable ZnO film by atomic layer deposition technique via inductively coupled plasma treatment
99Evaluation of Low Temperature Silicon Nitride Spacer for High-k Metal Gate Integration
100NiCO2O4@TiN Core-shell Electrodes through Conformal Atomic Layer Deposition for All-solid-state Supercapacitors
101Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
102Plasma enhanced atomic layer deposition of Ga2O3 thin films
103Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
104Atomic Layer Deposition of Aluminum Nitride Thin films from Trimethyl Aluminum (TMA) and Ammonia
105Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
106Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
107Growth behavior and structural characteristics of TiO2 thin films using (CpN)Ti(NMe2)2 and oxygen remote plasma
108Atomic Layer Deposition of Wet-Etch Resistant Silicon Nitride Using Di(sec-butylamino)silane and N2 Plasma on Planar and 3D Substrate Topographies
109Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide
110Advanced thin conformal Al2O3 films for high aspect ratio mercury cadmium telluride sensors
111Highly Conductive HfNx Films Prepared by Plasma-Assisted Atomic Layer Deposition
112Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications
113Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
114Plasma-Assisted ALD of LiPO(N) for Solid State Batteries
115Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
116An Analysis of the Deposition Mechanisms involved during Self-Limiting Growth of Aluminum Oxide by Pulsed PECVD
117Plasma Enhanced Atomic Layer Deposition of SiO2 Using Space-Divided Plasma System
118Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
119Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
120Plasma-enhanced atomic layer deposition: Correlating O2 plasma parameters and species to blister formation and conformal film growth
121Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
122ALD titanium nitride on vertically aligned carbon nanotube forests for electrochemical supercapacitors
123A PEALD Tunnel Dielectric for Three-Dimensional Non-Volatile Charge-Trapping Technology
124Initial growth, refractive index, and crystallinity of thermal and plasma-enhanced atomic layer deposition AlN films
125Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2