| 1 | A rotary reactor for thermal and plasma-enhanced atomic layer deposition on powders and small objects |
| 2 | Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM |
| 3 | Advanced thin conformal Al2O3 films for high aspect ratio mercury cadmium telluride sensors |
| 4 | ALD titanium nitride coated carbon nanotube electrodes for electrochemical supercapacitors |
| 5 | ALD titanium nitride on vertically aligned carbon nanotube forests for electrochemical supercapacitors |
| 6 | An Analysis of the Deposition Mechanisms involved during Self-Limiting Growth of Aluminum Oxide by Pulsed PECVD |
| 7 | Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization |
| 8 | Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects |
| 9 | Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications |
| 10 | Atomic layer deposition of aluminum fluoride using Al(CH3)3 and SF6 plasma |
| 11 | Atomic Layer Deposition of Aluminum Nitride Thin films from Trimethyl Aluminum (TMA) and Ammonia |
| 12 | Atomic layer deposition of aluminum thin films using an alternating supply of trimethylaluminum and a hydrogen plasma |
| 13 | Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor |
| 14 | Atomic layer deposition of HfO2 using HfCp(NMe2)3 and O2 plasma |
| 15 | Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide |
| 16 | Atomic Layer Deposition of Wet-Etch Resistant Silicon Nitride Using Di(sec-butylamino)silane and N2 Plasma on Planar and 3D Substrate Topographies |
| 17 | Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method |
| 18 | Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes |
| 19 | Characteristics of HfN films deposited by using remote plasma-enhanced atomic layer deposition |
| 20 | Characteristics of NiO films prepared by atomic layer deposition using bis(ethylcyclopentadienyl)-Ni and O2 plasma |
| 21 | Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method |
| 22 | Characteristics of Tungsten Carbide Films Prepared by Plasma-Assisted ALD Using Bis(tert-butylimido)bis(dimethylamido)tungsten |
| 23 | Chemically conformal deposition of SrTiO3 thin films by Atomic Layer Deposition using conventional metal organic precursors and remote-plasma activated H2O |
| 24 | Comparative study on growth characteristics and electrical properties of ZrO2 films grown using pulsed plasma-enhanced chemical vapor deposition and plasma-enhanced atomic layer deposition for oxide thin film transistors |
| 25 | Conformality of Al2O3 and AlN Deposited by Plasma-Enhanced Atomic Layer Deposition |
| 26 | Conformality of remote plasma-enhanced atomic layer deposition processes: An experimental study |
| 27 | Copper-ALD Seed Layer as an Enabler for Device Scaling |
| 28 | Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications |
| 29 | Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition |
| 30 | Effect of anode morphology on the performance of thin film solid oxide fuel cell with PEALD YSZ electrolyte |
| 31 | Electrical properties of SrTa2O6 thin films by plasma enhanced atomic layer deposition (PEALD) |
| 32 | Growth behavior and structural characteristics of TiO2 thin films using (CpN)Ti(NMe2)2 and oxygen remote plasma |
| 33 | Growth kinetics and initial stage growth during plasma-enhanced Ti atomic layer deposition |
| 34 | Growth of amorphous zinc tin oxide films using plasma-enhanced atomic layer deposition from bis(1-dimethylamino-2-methyl-2propoxy)tin, diethylzinc, and oxygen plasma |
| 35 | Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu |
| 36 | Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition |
| 37 | Hot-wire-assisted atomic layer deposition of a high quality cobalt film using cobaltocene: Elementary reaction analysis on NHx radical formation |
| 38 | Hydrogen plasma-enhanced atomic layer deposition of copper thin films |
| 39 | Impact of Plasma-Assisted Atomic-Layer-Deposited Gate Dielectric on Graphene Transistors |
| 40 | Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors |
| 41 | Initial growth, refractive index, and crystallinity of thermal and plasma-enhanced atomic layer deposition AlN films |
| 42 | Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications |
| 43 | Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers |
| 44 | Investigation of Tungsten Nitride Deposition Using Tungsten Hexafluoride Precursor for Via and Plug Metallization |
| 45 | Large-area plasmonic hot-spot arrays: sub-2 nm interparticle separations with plasma-enhanced atomic layer deposition of Ag on periodic arrays of Si nanopillars |
| 46 | Low Temperature Atomic Layer Deposition of Crystalline In2O3 Films |
| 47 | Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma |
| 48 | Low-temperature atomic layer deposition of TiO2, Al2O3,and ZnO thin films |
| 49 | Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient |
| 50 | Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition |
| 51 | NiCO2O4@TiN Core-shell Electrodes through Conformal Atomic Layer Deposition for All-solid-state Supercapacitors |
| 52 | Plasma Enhanced Atomic Layer Deposition of Al2O3 and TiN |
| 53 | Plasma enhanced atomic layer deposition of aluminum sulfide thin films |
| 54 | Plasma enhanced atomic layer deposition of Ga2O3 thin films |
| 55 | Plasma enhanced atomic layer deposition of SiNx:H and SiO2 |
| 56 | Plasma Enhanced Atomic Layer Deposition of SiO2 Using Space-Divided Plasma System |
| 57 | Plasma enhanced atomic layer deposition of SrTiO3 thin films with Sr(tmhd)2 and Ti(i-OPr)4 |
| 58 | Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects |
| 59 | Plasma enhanced atomic layer deposition of zinc sulfide thin films |
| 60 | Plasma Enhanced Atomic Layer Deposition on Powders |
| 61 | Plasma-Assisted ALD for the Conformal Deposition of SiO2: Process, Material and Electronic Properties |
| 62 | Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors |
| 63 | Plasma-assisted atomic layer deposition of conformal Pt films in high aspect ratio trenches |
| 64 | Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT) |
| 65 | Plasma-Enhanced Atomic Layer Deposition of Anatase TiO2 Using TiCl4 |
| 66 | Plasma-Enhanced Atomic Layer Deposition of Iron Phosphate as a Positive Electrode for 3D Lithium-Ion Microbatteries |
| 67 | Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride Using a Novel Silylamine Precursor |
| 68 | Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers |
| 69 | Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent |
| 70 | Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material |
| 71 | Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures |
| 72 | Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition |
| 73 | Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films |
| 74 | Radical Enhanced Atomic Layer Deposition of Tantalum Oxide - Thesis Coverage |
| 75 | Radical Enhanced Atomic Layer Deposition of Titanium Dioxide - Thesis Coverage |
| 76 | Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage |
| 77 | Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates |
| 78 | Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates - Thesis Coverage |
| 79 | Radical-enhanced atomic layer deposition of Y2O3 via a beta-diketonate precursor and O radicals |
| 80 | Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration |
| 81 | Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor |
| 82 | Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications |
| 83 | Study on the characteristics of aluminum thin films prepared by atomic layer deposition |
| 84 | The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications |
| 85 | Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality |
| 86 | Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN |
| 87 | Tuning Material Properties of Oxides and Nitrides by Substrate Biasing during Plasma-Enhanced Atomic Layer Deposition on Planar and 3D Substrate Topographies |
| 88 | Ultra-Thin Aluminium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition for Corrosion Protection |
| 89 | Very high frequency plasma reactant for atomic layer deposition |