Conformality, Step Coverage Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Conformality, Step Coverage returned 96 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

Number	Title
1	A rotary reactor for thermal and plasma-enhanced atomic layer deposition on powders and small objects
2	Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM
3	Advanced thin conformal Al2O3 films for high aspect ratio mercury cadmium telluride sensors
4	ALD titanium nitride coated carbon nanotube electrodes for electrochemical supercapacitors
5	ALD titanium nitride on vertically aligned carbon nanotube forests for electrochemical supercapacitors
6	An Analysis of the Deposition Mechanisms involved during Self-Limiting Growth of Aluminum Oxide by Pulsed PECVD
7	Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
8	Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
9	Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
10	Atomic layer deposition of aluminum fluoride using Al(CH3)3 and SF6 plasma
11	Atomic Layer Deposition of Aluminum Nitride Thin films from Trimethyl Aluminum (TMA) and Ammonia
12	Atomic layer deposition of aluminum thin films using an alternating supply of trimethylaluminum and a hydrogen plasma
13	Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
14	Atomic layer deposition of HfO2 using HfCp(NMe2)3 and O2 plasma
15	Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide
16	Atomic Layer Deposition of Wet-Etch Resistant Silicon Nitride Using Di(sec-butylamino)silane and N2 Plasma on Planar and 3D Substrate Topographies
17	Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
18	Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes
19	Characteristics of HfN films deposited by using remote plasma-enhanced atomic layer deposition
20	Characteristics of NiO films prepared by atomic layer deposition using bis(ethylcyclopentadienyl)-Ni and O2 plasma
21	Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method
22	Characteristics of Tungsten Carbide Films Prepared by Plasma-Assisted ALD Using Bis(tert-butylimido)bis(dimethylamido)tungsten
23	Chemically conformal deposition of SrTiO3 thin films by Atomic Layer Deposition using conventional metal organic precursors and remote-plasma activated H2O
24	Comparative study on growth characteristics and electrical properties of ZrO2 films grown using pulsed plasma-enhanced chemical vapor deposition and plasma-enhanced atomic layer deposition for oxide thin film transistors
25	Conformality of Al2O3 and AlN Deposited by Plasma-Enhanced Atomic Layer Deposition
26	Conformality of remote plasma-enhanced atomic layer deposition processes: An experimental study
27	Copper-ALD Seed Layer as an Enabler for Device Scaling
28	Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
29	Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
30	Effect of anode morphology on the performance of thin film solid oxide fuel cell with PEALD YSZ electrolyte
31	Electrical properties of SrTa2O6 thin films by plasma enhanced atomic layer deposition (PEALD)
32	Growth behavior and structural characteristics of TiO2 thin films using (CpN)Ti(NMe2)2 and oxygen remote plasma
33	Growth kinetics and initial stage growth during plasma-enhanced Ti atomic layer deposition
34	Growth of amorphous zinc tin oxide films using plasma-enhanced atomic layer deposition from bis(1-dimethylamino-2-methyl-2propoxy)tin, diethylzinc, and oxygen plasma
35	High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
36	Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu
37	Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition
38	Hot-wire-assisted atomic layer deposition of a high quality cobalt film using cobaltocene: Elementary reaction analysis on NHx radical formation
39	Hydrogen plasma-enhanced atomic layer deposition of copper thin films
40	Impact of Plasma-Assisted Atomic-Layer-Deposited Gate Dielectric on Graphene Transistors
41	Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
42	Initial growth, refractive index, and crystallinity of thermal and plasma-enhanced atomic layer deposition AlN films
43	Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
44	Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
45	Investigation of Tungsten Nitride Deposition Using Tungsten Hexafluoride Precursor for Via and Plug Metallization
46	Large-area plasmonic hot-spot arrays: sub-2 nm interparticle separations with plasma-enhanced atomic layer deposition of Ag on periodic arrays of Si nanopillars
47	Low Temperature Atomic Layer Deposition of Crystalline In2O3 Films
48	Low-impurity, highly conformal atomic layer deposition of titanium nitride using NH3-Ar-H2 plasma treatment for capacitor electrodes
49	Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
50	Low-temperature atomic layer deposition of TiO2, Al2O3,and ZnO thin films
51	Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient
52	Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
53	NiCO2O4@TiN Core-shell Electrodes through Conformal Atomic Layer Deposition for All-solid-state Supercapacitors
54	Plasma Enhanced Atomic Layer Deposition of Al2O3 and TiN
55	Plasma enhanced atomic layer deposition of aluminum sulfide thin films
56	Plasma enhanced atomic layer deposition of Ga2O3 thin films
57	Plasma enhanced atomic layer deposition of gallium sulfide thin films
58	Plasma enhanced atomic layer deposition of SiNx:H and SiO2
59	Plasma Enhanced Atomic Layer Deposition of SiO2 Using Space-Divided Plasma System
60	Plasma enhanced atomic layer deposition of SrTiO3 thin films with Sr(tmhd)2 and Ti(i-OPr)4
61	Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
62	Plasma enhanced atomic layer deposition of zinc sulfide thin films
63	Plasma Enhanced Atomic Layer Deposition on Powders
64	Plasma-Assisted ALD for the Conformal Deposition of SiO2: Process, Material and Electronic Properties
65	Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors
66	Plasma-assisted atomic layer deposition of conformal Pt films in high aspect ratio trenches
67	Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications
68	Plasma-assisted atomic layer deposition of TiN monitored by in situ spectroscopic ellipsometry
69	Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)
70	Plasma-Enhanced Atomic Layer Deposition of Anatase TiO2 Using TiCl4
71	Plasma-Enhanced Atomic Layer Deposition of Iron Phosphate as a Positive Electrode for 3D Lithium-Ion Microbatteries
72	Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride Using a Novel Silylamine Precursor
73	Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers
74	Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
75	Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
76	Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures
77	Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
78	Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
79	Radical Enhanced Atomic Layer Deposition of Tantalum Oxide - Thesis Coverage
80	Radical Enhanced Atomic Layer Deposition of Titanium Dioxide - Thesis Coverage
81	Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
82	Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates
83	Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates - Thesis Coverage
84	Radical-enhanced atomic layer deposition of Y2O3 via a beta-diketonate precursor and O radicals
85	Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
86	Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
87	Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
88	Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
89	Structural, electrical, and optical properties of transparent gallium oxide thin films grown by plasma-enhanced atomic layer deposition
90	Study on the characteristics of aluminum thin films prepared by atomic layer deposition
91	The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
92	Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality
93	Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
94	Tuning Material Properties of Oxides and Nitrides by Substrate Biasing during Plasma-Enhanced Atomic Layer Deposition on Planar and 3D Substrate Topographies
95	Ultra-Thin Aluminium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition for Corrosion Protection
96	Very high frequency plasma reactant for atomic layer deposition

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