Conformality, Step Coverage Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Conformality, Step Coverage returned 106 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A PEALD Tunnel Dielectric for Three-Dimensional Non-Volatile Charge-Trapping Technology
2A rotary reactor for thermal and plasma-enhanced atomic layer deposition on powders and small objects
3Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM
4Advanced thin conformal Al2O3 films for high aspect ratio mercury cadmium telluride sensors
5ALD titanium nitride coated carbon nanotube electrodes for electrochemical supercapacitors
6ALD titanium nitride on vertically aligned carbon nanotube forests for electrochemical supercapacitors
7An Analysis of the Deposition Mechanisms involved during Self-Limiting Growth of Aluminum Oxide by Pulsed PECVD
8Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
9Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
10Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
11Atomic layer deposition of aluminum fluoride using Al(CH3)3 and SF6 plasma
12Atomic Layer Deposition of Aluminum Nitride Thin films from Trimethyl Aluminum (TMA) and Ammonia
13Atomic layer deposition of aluminum thin films using an alternating supply of trimethylaluminum and a hydrogen plasma
14Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
15Atomic layer deposition of HfO2 using HfCp(NMe2)3 and O2 plasma
16Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide
17Atomic Layer Deposition of TiN/Al2O3/TiN Nanolaminates for Capacitor Applications
18Atomic Layer Deposition of Wet-Etch Resistant Silicon Nitride Using Di(sec-butylamino)silane and N2 Plasma on Planar and 3D Substrate Topographies
19Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
20Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
21Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes
22Characteristics of HfN films deposited by using remote plasma-enhanced atomic layer deposition
23Characteristics of NiO films prepared by atomic layer deposition using bis(ethylcyclopentadienyl)-Ni and O2 plasma
24Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method
25Characteristics of Tungsten Carbide Films Prepared by Plasma-Assisted ALD Using Bis(tert-butylimido)bis(dimethylamido)tungsten
26Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
27Chemically conformal deposition of SrTiO3 thin films by Atomic Layer Deposition using conventional metal organic precursors and remote-plasma activated H2O
28Comparative study on growth characteristics and electrical properties of ZrO2 films grown using pulsed plasma-enhanced chemical vapor deposition and plasma-enhanced atomic layer deposition for oxide thin film transistors
29Conformality of Al2O3 and AlN Deposited by Plasma-Enhanced Atomic Layer Deposition
30Conformality of remote plasma-enhanced atomic layer deposition processes: An experimental study
31Copper-ALD Seed Layer as an Enabler for Device Scaling
32Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
33Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
34Effect of anode morphology on the performance of thin film solid oxide fuel cell with PEALD YSZ electrolyte
35Electrical properties of Ga2O3-based dielectric thin films prepared by plasma enhanced atomic layer deposition (PEALD)
36Electrical properties of SrTa2O6 thin films by plasma enhanced atomic layer deposition (PEALD)
37Evaluation of Low Temperature Silicon Nitride Spacer for High-k Metal Gate Integration
38Growth behavior and structural characteristics of TiO2 thin films using (CpN)Ti(NMe2)2 and oxygen remote plasma
39Growth kinetics and initial stage growth during plasma-enhanced Ti atomic layer deposition
40Growth of amorphous zinc tin oxide films using plasma-enhanced atomic layer deposition from bis(1-dimethylamino-2-methyl-2propoxy)tin, diethylzinc, and oxygen plasma
41High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
42Highly Conductive HfNx Films Prepared by Plasma-Assisted Atomic Layer Deposition
43Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu
44Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition
45Hot-wire-assisted atomic layer deposition of a high quality cobalt film using cobaltocene: Elementary reaction analysis on NHx radical formation
46Hydrogen plasma-enhanced atomic layer deposition of copper thin films
47Impact of Plasma-Assisted Atomic-Layer-Deposited Gate Dielectric on Graphene Transistors
48Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
49In situ dry cleaning of Si wafer using OF2/NH3 remote plasma with low global warming potential
50Initial growth, refractive index, and crystallinity of thermal and plasma-enhanced atomic layer deposition AlN films
51Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
52Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
53Investigation of Tungsten Nitride Deposition Using Tungsten Hexafluoride Precursor for Via and Plug Metallization
54Large-area plasmonic hot-spot arrays: sub-2 nm interparticle separations with plasma-enhanced atomic layer deposition of Ag on periodic arrays of Si nanopillars
55Low Temperature Atomic Layer Deposition of Crystalline In2O3 Films
56Low-impurity, highly conformal atomic layer deposition of titanium nitride using NH3-Ar-H2 plasma treatment for capacitor electrodes
57Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
58Low-temperature atomic layer deposition of TiO2, Al2O3,and ZnO thin films
59Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient
60Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
61Nanometer-Thick Conformal Pore Sealing of Self-Assembled Mesoporous Silica by Plasma-Assisted Atomic Layer Deposition
62NiCO2O4@TiN Core-shell Electrodes through Conformal Atomic Layer Deposition for All-solid-state Supercapacitors
63Plasma Enhanced Atomic Layer Deposition of Al2O3 and TiN
64Plasma enhanced atomic layer deposition of aluminum sulfide thin films
65Plasma enhanced atomic layer deposition of Ga2O3 thin films
66Plasma enhanced atomic layer deposition of gallium sulfide thin films
67Plasma enhanced atomic layer deposition of SiNx:H and SiO2
68Plasma Enhanced Atomic Layer Deposition of SiO2 Using Space-Divided Plasma System
69Plasma enhanced atomic layer deposition of SrTiO3 thin films with Sr(tmhd)2 and Ti(i-OPr)4
70Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
71Plasma enhanced atomic layer deposition of zinc sulfide thin films
72Plasma Enhanced Atomic Layer Deposition on Powders
73Plasma-Assisted ALD for the Conformal Deposition of SiO2: Process, Material and Electronic Properties
74Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors
75Plasma-assisted atomic layer deposition of conformal Pt films in high aspect ratio trenches
76Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications
77Plasma-assisted atomic layer deposition of TiN monitored by in situ spectroscopic ellipsometry
78Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)
79Plasma-Enhanced Atomic Layer Deposition of Anatase TiO2 Using TiCl4
80Plasma-Enhanced Atomic Layer Deposition of Iron Phosphate as a Positive Electrode for 3D Lithium-Ion Microbatteries
81Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride Using a Novel Silylamine Precursor
82Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers
83Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
84Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
85Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures
86Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
87Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
88Radical Enhanced Atomic Layer Deposition of Tantalum Oxide - Thesis Coverage
89Radical Enhanced Atomic Layer Deposition of Titanium Dioxide
90Radical Enhanced Atomic Layer Deposition of Titanium Dioxide - Thesis Coverage
91Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
92Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates
93Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates - Thesis Coverage
94Radical-enhanced atomic layer deposition of Y2O3 via a beta-diketonate precursor and O radicals
95Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
96Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
97Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
98Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
99Structural, electrical, and optical properties of transparent gallium oxide thin films grown by plasma-enhanced atomic layer deposition
100Study on the characteristics of aluminum thin films prepared by atomic layer deposition
101The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
102Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality
103Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
104Tuning Material Properties of Oxides and Nitrides by Substrate Biasing during Plasma-Enhanced Atomic Layer Deposition on Planar and 3D Substrate Topographies
105Ultra-Thin Aluminium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition for Corrosion Protection
106Very high frequency plasma reactant for atomic layer deposition


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