Conformality, Step Coverage Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Conformality, Step Coverage returned 99 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A rotary reactor for thermal and plasma-enhanced atomic layer deposition on powders and small objects
2Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM
3Advanced thin conformal Al2O3 films for high aspect ratio mercury cadmium telluride sensors
4ALD titanium nitride coated carbon nanotube electrodes for electrochemical supercapacitors
5ALD titanium nitride on vertically aligned carbon nanotube forests for electrochemical supercapacitors
6An Analysis of the Deposition Mechanisms involved during Self-Limiting Growth of Aluminum Oxide by Pulsed PECVD
7Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
8Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
9Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
10Atomic layer deposition of aluminum fluoride using Al(CH3)3 and SF6 plasma
11Atomic Layer Deposition of Aluminum Nitride Thin films from Trimethyl Aluminum (TMA) and Ammonia
12Atomic layer deposition of aluminum thin films using an alternating supply of trimethylaluminum and a hydrogen plasma
13Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
14Atomic layer deposition of HfO2 using HfCp(NMe2)3 and O2 plasma
15Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide
16Atomic Layer Deposition of Wet-Etch Resistant Silicon Nitride Using Di(sec-butylamino)silane and N2 Plasma on Planar and 3D Substrate Topographies
17Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
18Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes
19Characteristics of HfN films deposited by using remote plasma-enhanced atomic layer deposition
20Characteristics of NiO films prepared by atomic layer deposition using bis(ethylcyclopentadienyl)-Ni and O2 plasma
21Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method
22Characteristics of Tungsten Carbide Films Prepared by Plasma-Assisted ALD Using Bis(tert-butylimido)bis(dimethylamido)tungsten
23Chemically conformal deposition of SrTiO3 thin films by Atomic Layer Deposition using conventional metal organic precursors and remote-plasma activated H2O
24Comparative study on growth characteristics and electrical properties of ZrO2 films grown using pulsed plasma-enhanced chemical vapor deposition and plasma-enhanced atomic layer deposition for oxide thin film transistors
25Conformality of Al2O3 and AlN Deposited by Plasma-Enhanced Atomic Layer Deposition
26Conformality of remote plasma-enhanced atomic layer deposition processes: An experimental study
27Copper-ALD Seed Layer as an Enabler for Device Scaling
28Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
29Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
30Effect of anode morphology on the performance of thin film solid oxide fuel cell with PEALD YSZ electrolyte
31Electrical properties of Ga2O3-based dielectric thin films prepared by plasma enhanced atomic layer deposition (PEALD)
32Electrical properties of SrTa2O6 thin films by plasma enhanced atomic layer deposition (PEALD)
33Growth behavior and structural characteristics of TiO2 thin films using (CpN)Ti(NMe2)2 and oxygen remote plasma
34Growth kinetics and initial stage growth during plasma-enhanced Ti atomic layer deposition
35Growth of amorphous zinc tin oxide films using plasma-enhanced atomic layer deposition from bis(1-dimethylamino-2-methyl-2propoxy)tin, diethylzinc, and oxygen plasma
36High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
37Highly Conductive HfNx Films Prepared by Plasma-Assisted Atomic Layer Deposition
38Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu
39Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition
40Hot-wire-assisted atomic layer deposition of a high quality cobalt film using cobaltocene: Elementary reaction analysis on NHx radical formation
41Hydrogen plasma-enhanced atomic layer deposition of copper thin films
42Impact of Plasma-Assisted Atomic-Layer-Deposited Gate Dielectric on Graphene Transistors
43Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
44In situ dry cleaning of Si wafer using OF2/NH3 remote plasma with low global warming potential
45Initial growth, refractive index, and crystallinity of thermal and plasma-enhanced atomic layer deposition AlN films
46Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
47Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
48Investigation of Tungsten Nitride Deposition Using Tungsten Hexafluoride Precursor for Via and Plug Metallization
49Large-area plasmonic hot-spot arrays: sub-2 nm interparticle separations with plasma-enhanced atomic layer deposition of Ag on periodic arrays of Si nanopillars
50Low Temperature Atomic Layer Deposition of Crystalline In2O3 Films
51Low-impurity, highly conformal atomic layer deposition of titanium nitride using NH3-Ar-H2 plasma treatment for capacitor electrodes
52Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
53Low-temperature atomic layer deposition of TiO2, Al2O3,and ZnO thin films
54Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient
55Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
56NiCO2O4@TiN Core-shell Electrodes through Conformal Atomic Layer Deposition for All-solid-state Supercapacitors
57Plasma Enhanced Atomic Layer Deposition of Al2O3 and TiN
58Plasma enhanced atomic layer deposition of aluminum sulfide thin films
59Plasma enhanced atomic layer deposition of Ga2O3 thin films
60Plasma enhanced atomic layer deposition of gallium sulfide thin films
61Plasma enhanced atomic layer deposition of SiNx:H and SiO2
62Plasma Enhanced Atomic Layer Deposition of SiO2 Using Space-Divided Plasma System
63Plasma enhanced atomic layer deposition of SrTiO3 thin films with Sr(tmhd)2 and Ti(i-OPr)4
64Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
65Plasma enhanced atomic layer deposition of zinc sulfide thin films
66Plasma Enhanced Atomic Layer Deposition on Powders
67Plasma-Assisted ALD for the Conformal Deposition of SiO2: Process, Material and Electronic Properties
68Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors
69Plasma-assisted atomic layer deposition of conformal Pt films in high aspect ratio trenches
70Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications
71Plasma-assisted atomic layer deposition of TiN monitored by in situ spectroscopic ellipsometry
72Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)
73Plasma-Enhanced Atomic Layer Deposition of Anatase TiO2 Using TiCl4
74Plasma-Enhanced Atomic Layer Deposition of Iron Phosphate as a Positive Electrode for 3D Lithium-Ion Microbatteries
75Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride Using a Novel Silylamine Precursor
76Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers
77Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
78Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
79Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures
80Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
81Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
82Radical Enhanced Atomic Layer Deposition of Tantalum Oxide - Thesis Coverage
83Radical Enhanced Atomic Layer Deposition of Titanium Dioxide - Thesis Coverage
84Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
85Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates
86Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates - Thesis Coverage
87Radical-enhanced atomic layer deposition of Y2O3 via a beta-diketonate precursor and O radicals
88Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
89Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
90Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
91Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
92Structural, electrical, and optical properties of transparent gallium oxide thin films grown by plasma-enhanced atomic layer deposition
93Study on the characteristics of aluminum thin films prepared by atomic layer deposition
94The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
95Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality
96Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
97Tuning Material Properties of Oxides and Nitrides by Substrate Biasing during Plasma-Enhanced Atomic Layer Deposition on Planar and 3D Substrate Topographies
98Ultra-Thin Aluminium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition for Corrosion Protection
99Very high frequency plasma reactant for atomic layer deposition


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