
Conformality of remote plasma-enhanced atomic layer deposition processes: An experimental study
Type:
Journal
Info:
J. Vac. Sci. Technol. A 30(1), Jan/Feb 2012
Date:
2011-10-19
Author Information
| Name | Institution |
|---|---|
| Maarit I. Kariniemi | University of Helsinki |
| Jaakko T. Niinistö | University of Helsinki |
| Marko Vehkamäki | University of Helsinki |
| Marianna Kemell | University of Helsinki |
| Mikko K. Ritala | University of Helsinki |
| Markku A. Leskelä | University of Helsinki |
| Matti Putkonen | Beneq Oy |
Films
Plasma SiO2
Plasma HfO2
Plasma Al2O3
Plasma TiO2
Plasma Ta2O5
Plasma Ag
Film/Plasma Properties
Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Substrates
| Silicon |
| SiO2 |
| TiN |
Notes
| Aeronex GateKeeper and Entegris GateKeeper gas purifiers used. |
| Beneq TFS-200 study on high aspect ratio conformality of SiO2, HfO2, Al2O3, TiO2, Ta2O5, and Ag PEALD films. |
| 171 |
