Publication Information

Title:
Conformality of remote plasma-enhanced atomic layer deposition processes: An experimental study
Type:
Journal
Info:
J. Vac. Sci. Technol. A 30(1), Jan/Feb 2012
Date:
2011-10-19

Author Information

Name Institution
Maarit I. KariniemiUniversity of Helsinki
Jaakko T. NiinistöUniversity of Helsinki
Marko VehkamäkiUniversity of Helsinki
Marianna KemellUniversity of Helsinki
Mikko K. RitalaUniversity of Helsinki
Markku A. LeskeläUniversity of Helsinki
Matti PutkonenBeneq Oy

Films

Plasma SiO2



Plasma Al2O3


Plasma TiO2


Plasma Ta2O5



Film/Plasma Properties

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Substrates

Silicon
SiO2
TiN

Keywords

High Aspect Ratio

Notes

Aeronex GateKeeper and Entegris GateKeeper gas purifiers used.
Beneq TFS-200 study on high aspect ratio conformality of SiO2, HfO2, Al2O3, TiO2, Ta2O5, and Ag PEALD films.
171