Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors
Type:
Journal
Info:
Thin Solid Films 558 (2014) 93 - 98
Date:
2014-02-26
Author Information
| Name | Institution |
|---|---|
| Matti Putkonen | VTT Technical Research Centre |
| Markus Bosund | Beneq Oy |
| Oili M. E. Ylivaara | VTT Technical Research Centre |
| Riikka L. Puurunen | VTT Technical Research Centre |
| Lauri Kilpi | VTT Technical Research Centre |
| Helena Ronkainen | VTT Technical Research Centre |
| Sakari Sintonen | Aalto University |
| Saima Ali | Aalto University |
| Harri Lipsanen | Aalto University |
| Xuwen Liu | Aalto University |
| Eero Haimi | Aalto University |
| Simo-Pekka Hannula | Aalto University |
| Timo Sajavaara | University of Jyväskylä |
| Iain Buchanan | Air Products |
| Eugene Karwacki | Air Products |
| Mika Vähä-Nissi | VTT Technical Research Centre |
Films
Thermal SiO2
Thermal SiO2
Plasma SiO2
Thermal SiO2
Plasma SiO2
Film/Plasma Properties
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Uniformity
Analysis: Ellipsometry
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Uniformity
Analysis: Ellipsometry
Characteristic: Chemical Composition, Impurities
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Stress
Analysis: Wafer Curvature
Characteristic: Adhesion
Analysis: Scratch Testing
Characteristic: Hardness
Analysis: Nanoindentation
Characteristic: Elastic Modulus
Analysis: Nanoindentation
Characteristic: Wetting Angle
Analysis: Contact Angle Measurement
Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Substrates
| Si(100) |
| Corning D263T |
| BSG, BoroSilicate Glass |
Notes
| 1492 |