Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:

  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

Contact us for more information.



Low temperature Topographically Selective Deposition by Plasma Enhanced Atomic Layer Deposition with ion bombardment assistance

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 39(3) 2021 032416
Date:
2021-04-12

Author Information

Name Institution
Taguhi YeghoyanGrenoble Alps University (UGA)
Vincent PesceGrenoble Alps University (UGA)
Moustapha JaffalGrenoble Alps University (UGA)
Jaan AarikGrenoble Alps University (UGA)
Rémy GassilloudCEA - LETI MINATEC
Nicolas PossemeCEA - LETI MINATEC
Marceline BonvalotGrenoble Alps University (UGA)
Christophe ValléeGrenoble Alps University (UGA)

Films


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Refractive Index
Analysis: Ellipsometry

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity

Characteristic: Wet Etch Resistance
Analysis: -

Substrates

Si with native oxide

Notes

1713