Plasma-Assisted ALD for the Conformal Deposition of SiO2: Process, Material and Electronic Properties
Info:
Journal of The Electrochemical Society, 159 (3) H277-H285 (2012)
Author Information
Films
Film/Plasma Properties
Analysis: TEM, Transmission Electron Microscope
Analysis: RBS, Rutherford Backscattering Spectrometry
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis
Analysis: FTIR, Fourier Transform InfraRed spectroscopy
Analysis: AFM, Atomic Force Microscopy
Analysis: TEM, Transmission Electron Microscope
Analysis: SEM, Scanning Electron Microscopy
Analysis: QMS, Quadrupole Mass Spectrometer
Analysis: OES, Optical Emission Spectroscopy
Analysis: Photoconductance
Analysis: Photoconductance
Analysis: C-V, Capacitance-Voltage Measurements
Analysis: C-V, Capacitance-Voltage Measurements
Substrates
Notes