Plasma-enhanced atomic layer deposition: Correlating O2 plasma parameters and species to blister formation and conformal film growth

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 39, 062402 (2021)
Date:
2021-08-26

Author Information

Name Institution
Andreas WerbrouckGhent University
Kevin Van de KerckhoveGhent University
Diederik DeplaGhent University
Dirk PoelmanGhent University
Philippe F. SmetGhent University
Jolien DendoovenGhent University
Christophe DetavernierGhent University

Films



Film/Plasma Properties

Characteristic: Ion Energy
Analysis: Ion Energy Analyzer

Characteristic: Plasma Species
Analysis: QMS, Quadrupole Mass Spectrometer

Characteristic: Plasma Species
Analysis: OES, Optical Emission Spectroscopy

Characteristic: Plasma Species
Analysis: OES, Optical Emission Spectroscopy

Characteristic: Conformality, Step Coverage
Analysis: Custom

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Substrates

Silicon

Keywords

High Aspect Ratio
Blistering

Notes

1664