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Nanometer-Thick Conformal Pore Sealing of Self-Assembled Mesoporous Silica by Plasma-Assisted Atomic Layer Deposition

Type:
Journal
Info:
J. Am. Chem. Soc. 2006, 128, 34 11018-11019
Date:
2006-08-09
DOI:
http://dx.doi.org/10.1021/ja061097d

Author Information

Name Institution
Ying-Bing JiangUniversity of New Mexico
Nanguo LiuUniversity of New Mexico
Henry GerungUniversity of New Mexico
Joseph L. CecchiUniversity of New Mexico
C. Jeffrey BrinkerUniversity of New Mexico

Films

Plasma SiO2

Hardware used: Custom Remote Inductively Coupled Plasma
TEOS, Si(OC2H5)4, TetraEthyl OrthoSilicate
CAS#: 78-10-4
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Diagnostic: -

Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope
Diagnostic: -

Characteristic: Diffusion Barrier Properties
Analysis: TEM, Transmission Electron Microscope
Diagnostic: -

Substrates

Mesoporous Silica

Notes

1351