Publication Information

Title:
Plasma Enhanced Atomic Layer Deposition of SiO2 Using Space-Divided Plasma System
Type:
Journal
Info:
Science of Advanced Materials, Volume 8, Number 4 2016, pp. 872-877
Date:
2016-04-01

Author Information

Name Institution
Hyuckjip ChoiKwangwoon University
Han S. UhmKwangwoon University
Gi-Chung KwonKwangwoon University
Byungha ChoKwangwoon University
Jinhyuck YooKwangwoon University

Films

Plasma SiO2


Plasma SiON


Film/Plasma Properties

Characteristic: Wet Etch Resistance
Analysis: Wet Etch

Characteristic: Conformality, Step Coverage
Analysis: -

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope

Characteristic: Interfacial Layer
Analysis: TEM, Transmission Electron Microscope

Characteristic: Morphology, Roughness, Topography
Analysis: -

Substrates

Keywords

Notes

Used conference abstract for some additional info.
891