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An economical, compact inductively coupled plasma source.

Ideal for:

  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

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Chemically conformal deposition of SrTiO3 thin films by Atomic Layer Deposition using conventional metal organic precursors and remote-plasma activated H2O

Type:
Journal
Info:
Microelectronic Engineering 80 (2005) 158 - 161
Date:
2005-06-04

Author Information

Name Institution
Sang Woon LeeSeoul National University
Oh Seong KwonSeoul National University
Cheol Seong HwangSeoul National University

Films


Plasma TiO2



Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Chemical Composition, Impurities
Analysis: XRF, X-Ray Fluorescence

Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope

Characteristic: EOT, Equivalent Oxide Thickness
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements

Substrates

SiO2
Ru

Notes

1243