Plasma-assisted atomic layer deposition of conformal Pt films in high aspect ratio trenches

Type:
Journal
Info:
The Journal of Chemical Physics 146, 052818 (2017)
Date:
2016-11-29
DOI:
http://dx.doi.org/10.1063/1.4972120

Author Information

Name Institution
Ivo Johannes Maria ErkensEindhoven University of Technology
Marcel A. VerheijenEindhoven University of Technology
Harm C. M. KnoopsEindhoven University of Technology
Wytze KeuningEindhoven University of Technology
Fred RoozeboomEindhoven University of Technology
Erwin (W.M.M.) KesselsEindhoven University of Technology

Films

Plasma Pt

Hardware used: Custom Remote Inductively Coupled Plasma
(Trimethyl)methylcyclopentadienylplatinum, MeCpMe3Pt
CAS#: 94442-22-5
Where to buy precursor
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 300C

Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry
Diagnostic: J.A. Woollam M-2000U

Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: JEOL 7500F

Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope
Diagnostic: FEI Tecnai F30ST

Substrates

SiO2

Keywords

Notes

897