Leakage Current Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Leakage Current returned 163 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

Number	Title
1	A comparative study of AlN and Al2O3 based gate stacks grown by atomic layer deposition on InGaAs
2	A comparison between HfO2/Al2O3 nano-laminates and ternary HfxAlyO compound as the dielectric material in InGaAs based metal-oxide-semiconductor (MOS) capacitors
3	A Silicon Nitride MIM Capacitor for Analog/Mixed-Signal Integrated Circuit using Manufacturable Atomic Layer Deposition Equipment
4	Advances in the fabrication of graphene transistors on flexible substrates
5	Al2O3/SiO2 nanolaminate for a gate oxide in a GaN-based MOS device
6	AlN Surface Passivation of GaN-Based High Electron Mobility Transistors by Plasma-Enhanced Atomic Layer Deposition
7	An Analysis of the Deposition Mechanisms involved during Self-Limiting Growth of Aluminum Oxide by Pulsed PECVD
8	An improvement of HfO2/Ge interface by in situ remote N2 plasma pretreatment for Ge MOS devices
9	Annealing behavior of ferroelectric Si-doped HfO2 thin films
10	Atomic Layer Deposition and Electrical Properties of SrTiO3 Thin Films Grown Using Sr(C11H19O2)2, Ti(Oi-C3H7)4, and H2O
11	Atomic Layer Deposition of Al2O3 Thin Films for Metal Insulator Semiconductor Applications on 4H-SiC
12	Atomic layer deposition of B2O3/SiO2 thin films and their application in an efficient diffusion doping process
13	Atomic Layer Deposition of HfO2 Thin Films on Ultrathin SiO2 Formed by Remote Plasma Oxidation
14	Atomic Layer Deposition of Ultrathin Crystalline Epitaxial Films of V2O5
15	Atomic layer deposition precursor step repetition and surface plasma pretreatment influence on semiconductor-insulator-semiconductor heterojunction solar cell
16	Atomic scale nitrogen depth profile control during plasma enhanced atomic layer deposition of high k dielectrics
17	Characteristics of Al2O3 Thin Films Deposited Using Dimethylaluminum Isopropoxide and Trimethylaluminum Precursors by the Plasma-Enhanced Atomic-Layer Deposition Method
18	Characteristics of Atomic-Layer-Deposited HfO2 Films by Using a Remote Plasma on Pre-Deposited Hf Metal Layer
19	Characteristics of Hf-silicate thin films synthesized by plasma enhanced atomic layer deposition
20	Characteristics of HfO2 thin films deposited by plasma-enhanced atomic layer deposition using O2 plasma and N2O plasma
21	Characteristics of high-k dielectric ECR-ALD lanthanum hafnium oxide (LHO) films
22	Characteristics of remote plasma atomic layer-deposited HfO2 films on O2 and N2 plasma-pretreated Si substrates
23	Characteristics of TiO2 Films Prepared by ALD With and Without Plasma
24	Characteristics of ZrO2 gate dielectric deposited using Zr(t –butoxide) and Zr(NEt2)4 precursors by plasma enhanced atomic layer deposition method
25	Characterization of AlON-TiON Stacked Insulators For ZnS:Mn Thin Film Electroluminescent Devices
26	Characterization of HfOxNy thin film formation by in-situ plasma enhanced atomic layer deposition using NH3 and N2 plasmas
27	Characterizations of Al2O3 gate dielectric deposited on n-GaN by plasma-assisted atomic layer deposition
28	Chemically conformal deposition of SrTiO3 thin films by Atomic Layer Deposition using conventional metal organic precursors and remote-plasma activated H2O
29	Combined plasma-enhanced-atomic-layer-deposition gate dielectric and in situ SiN cap layer for reduced threshold voltage shift and dynamic ON-resistance dispersion of AlGaN/GaN high electron mobility transistors on 200 mm Si substrates
30	Comparative study on growth characteristics and electrical properties of ZrO2 films grown using pulsed plasma-enhanced chemical vapor deposition and plasma-enhanced atomic layer deposition for oxide thin film transistors
31	Comparison of the Deposition Characteristics and Electrical Properties for La2O3, HfO2 and LHO Films
32	Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition
33	Dielectric Properties of Thermal and Plasma-Assisted Atomic Layer Deposited Al2O3 Thin Films
34	Effect of DC Bias on the Plasma Properties in Remote Plasma Atomic Layer Deposition and Its Application to HfO2 Thin Films
35	Effect of NH3 plasma passivation on the electrical characteristics of a nanolaminated ALD HfAlO on InGaAs MOS capacitor
36	Effect of Nitrogen Incorporation in HfO2 Films Deposited by Plasma-Enhanced Atomic Layer Deposition
37	Effect of plasma and heat treatment on silicon dioxide films by plasma-enhanced atomic layer deposition
38	Effect of Plasma on Characteristics of Zirconium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition
39	Effect of postdeposition annealing on the electrical properties of beta-Ga2O3 thin films grown on p-Si by plasma-enhanced atomic layer deposition
40	Effect of Thermal Annealing on La2O3 Films Grown by Plasma Enhanced Atomic Layer Deposition
41	Effects of an Al2O3 capping layer on La2O3 deposited by remote plasma atomic layer deposition
42	Effects of Cl-Based Ligand Structures on Atomic Layer Deposited HfO2
43	Effects of Fluorine Plasma Treatment on the Electronic Structure of Plasma-Enhanced Atomic Layer Deposition HfO2
44	Electrical and physical characteristics of high-k gated MOSFETs with in-situ H2O and O2 plasma formed interfacial layer
45	Electrical characteristics of Ga2O3-TiO2 nanomixed films grown by plasma-enhanced atomic-layer deposition for gate dielectric applications
46	Electrical Characteristics of n, p-In0.53Ga0.47As MOSCAPs With In Situ PEALD-AlN Interfacial Passivation Layer
47	Electrical Characterization of Metal-Insulator-Semiconductor Capacitors Having Double-Layered Atomic-Layer-Deposited Al2O3 and ZnO for Transparent Thin Film Transistor Applications
48	Electrical Properties of Al2O3 Films Grown by the Electron Cyclotron Resonance Plasma-Enhanced Atomic Layer Deposition (ECR-PEALD) and Thermal ALD Methods
49	Electrical Properties of Alumina Films by Plasma-Enhanced Atomic Layer Deposition
50	Electrical properties of SrTa2O6 thin films by plasma enhanced atomic layer deposition (PEALD)
51	Electronic Conduction Mechanisms in Insulators
52	Electronic properties of atomic-layer-deposited high-k dielectrics on GaSb(001) with hydrogen plasma pretreatment
53	Enhancement of Electrical Characteristics and Reliability in Crystallized ZrO2 Gate Dielectrics Treated with In-Situ Atomic Layer Doping of Nitrogen
54	Evaluation of NbN thin films grown by MOCVD and plasma-enhanced ALD for gate electrode application in high-k/SiO2 gate stacks
55	Examining the role of hydrogen in the electrical performance of in situ fabricated metal-insulator-metal trilayers using an atomic layer deposited Al2O3 dielectric
56	Fabrication and properties of AlN film on GaN substrate by using remote plasma atomic layer deposition method
57	Fabrication and Properties of GaN MIS Capacitors with a Remote-Plasma Atomic-Layer-Deposited Al2O3 Gate Dielectric
58	Fabrication of self-aligned TFTs with a ultra-low temperature polycrystalline silicon process on metal foils
59	Fast Flexible Plastic Substrate ZnO Circuits
60	Fast PEALD ZnO Thin-Film Transistor Circuits
61	Ferroelectric phenomena in Si-doped HfO2 thin films with TiN and Ir electrodes
62	Film properties of low temperature HfO2 grown with H2O, O3, or remote O2-plasma
63	Flexible insulator of hollow SiO2 spheres and polyimide hybrid for flexible OLED
64	Growth characteristics and electrical properties of La2O3 gate oxides grown by thermal and plasma-enhanced atomic layer deposition
65	Growth characteristics and electrical properties of SiO2 thin films prepared using plasma-enhanced atomic layer deposition and chemical vapor deposition with an aminosilane precursor
66	Growth Characteristics and Film Properties of Cerium Dioxide Prepared by Plasma-Enhanced Atomic Layer Deposition
67	HfO2/HfOxNy/HfO2 Gate Dielectric Fabricated by In Situ Oxidation of Plasma-Enhanced Atomic Layer Deposition HfN Middle Layer
68	High aspect ratio iridescent three-dimensional metal-insulator-metal capacitors using atomic layer deposition
69	High Energy Density Capacitor By Plasma-Treated ALD BaTiO3 Thin Films
70	High Mobility (210cm2/Vs), High Capacitance (7.2uF/cm2) ZrO2 on GaN Metal Oxide Semiconductor Capacitor via ALD
71	High-k GaAs metal insulator semiconductor capacitors passivated by ex-situ plasma-enhanced atomic layer deposited AlN for Fermi-level unpinning
72	High-Quality Low-Temperature Silicon Oxide by Plasma-Enhanced Atomic Layer Deposition Using a Metal-Organic Silicon Precursor and Oxygen Radical
73	Impact of AlN Interfacial Dipole on Effective Work Function of Ni and Band Alignment of Ni/HfO2/In0.53Ga0.47As Gate-Stack
74	Impact of composition and crystallization behavior of atomic layer deposited strontium titanate films on the resistive switching of Pt/STO/TiN devices
75	Impact of nitrogen depth profiles on the electrical properties of crystalline high-K gate dielectrics
76	Impact of Plasma-Assisted Atomic-Layer-Deposited Gate Dielectric on Graphene Transistors
77	Improved Electrical Properties of Crystalline ZrO2/Al2O3 Buffer Gate Stack with Double Nitridation
78	Improved stability of electrical properties of nitrogen-added Al2O3 films grown by PEALD as gate dielectric
79	Improvement in electrical characteristics of HfO2 gate dielectrics treated by remote NH3 plasma
80	Improvement of Capacitance Equivalent Thickness, Leakage Current, and Interfacial State Density Based on Crystallized High-K Dielectrics/Nitrided Buffer Layer Gate Stacks
81	Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
82	Improving Thermal Stability and Interface State Density of High-k Stacks by Incorporating Hf into an Interfacial Layer on p-Germanium
83	In situ atomic layer nitridation on the top and down regions of the amorphous and crystalline high-K gate dielectrics
84	In situ plasma enhanced atomic layer deposition half cycle study of Al2O3 on AlGaN/GaN high electron mobility transistors
85	In situ surface cleaning on a Ge substrate using TMA and MgCp2 for HfO2-based gate oxides
86	In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
87	In-gap states in titanium dioxide and oxynitride atomic layer deposited films
88	Increment of the Dielectric Constant of Ta2O5 Thin Films by Retarding Interface Oxide Growth on Si Substrates
89	Influence of Atomic Layer Deposition Temperatures on TiO2/n-Si MOS Capacitor
90	Influence of oxidant source on the property of atomic layer deposited Al2O3 on hydrogen-terminated Si substrate
91	Influence of Pre and Post-treatments on Plasma Enhanced ALD SiO2 and Al2O3 layers on GaN
92	Influence of stoichiometry on the performance of MIM capacitors from plasma-assisted ALD SrxTiyOz films
93	Interface and plasma damage analysis of PEALD TaCN deposited on HfO2 for advanced CMOS studied by angle resolved XPS and C-V
94	Interface engineering of an AlNO/AlGaN/GaN MIS diode induced by PEALD alternate insertion of AlN in Al2O3
95	Interfacial, Electrical, and Band Alignment Characteristics of HfO2/Ge Stacks with In Situ-Formed SiO2 Interlayer by Plasma-Enhanced Atomic Layer Deposition
96	Investigation of a Two-Layer Gate Insulator Using Plasma-Enhanced ALD for Ultralow Temperature Poly-Si TFTs
97	Leakage Current Reduction in ALD-Al2O3 Dielectric Deposited on Si by High Pressure Deuterium Oxide Annealing
98	Low EOT GeO2/Al2O3/HfO2 on Ge substrate using ultrathin Al deposition
99	Low Temperature Formation of Silicon Oxide Thin Films by Atomic Layer Deposition Using NH3/O2 Plasma
100	Low Voltage Switching Characteristics of 60 nm Thick SrBi2Ta2O9 Thin Films Deposited by Plasma-Enhanced ALD
101	Low-Leakage Tetragonal ZrO2 (EOT < 1 nm) With In Situ Plasma Interfacial Passivation on Germanium
102	Low-Temperature Deposition of Aluminum Oxide by Radical Enhanced Atomic Layer Deposition - Thesis Coverage
103	Low-Temperature Growth of SiO2 Films by Plasma-Enhanced Atomic Layer Deposition
104	Low-temperature plasma-enhanced atomic layer deposition of HfO2/Al2O3 nanolaminate structure on Si
105	MANOS performance dependence on ALD Al2O3 oxidation source
106	Mechanical and electrical properties of plasma and thermal atomic layer deposited Al2O3 films on GaAs and Si
107	Negative charge trapping effects in Al2O3 films grown by atomic layer deposition onto thermally oxidized 4H-SiC
108	Nonhomogeneous spatial distribution of filamentary leakage current paths in circular area Pt/HfO2/Pt capacitors
109	Normally-off AlGaN/GaN-on-Si metal-insulator-semiconductor heterojunction field-effect transistor with nitrogen-incorporated silicon oxide gate insulator
110	Obtaining low resistivity (~100 µΩ cm) TiN films by plasma enhanced atomic layer deposition using a metalorganic precursor
111	Optical and Electrical Properties of AlxTi1-xO Films
112	Oxide Charge Engineering of Atomic Layer Deposited AlOxNy/Al2O3 Gate Dielectrics: A Path to Enhancement Mode GaN Devices
113	Oxygen migration in TiO2-based higher-k gate stacks
114	PEALD of Zirconium Oxide Using Tetrakis(ethylmethylamino)zirconium and Oxygen
115	Plasma enhanced atomic layer batch processing of aluminum doped titanium dioxide
116	Plasma Enhanced Atomic Layer Deposition of Al2O3/SiO2 MIM Capacitors
117	Plasma enhanced atomic layer deposition of HfO2 and ZrO2 high-k thin films
118	Plasma enhanced atomic layer deposition of SrTiO3 thin films with Sr(tmhd)2 and Ti(i-OPr)4
119	Plasma Enhanced Atomic Layer Deposition Passivated HfO2/AlN/In0.53Ga0.47As MOSCAPs With Sub-Nanometer Equivalent Oxide Thickness and Low Interface Trap Density
120	Plasma-assisted atomic layer deposition of Al2O3 and parylene C bi-layer encapsulation for chronic implantable electronics
121	Plasma-assisted atomic layer deposition of TiN/Al2O3 stacks for metal-oxide-semiconductor capacitor applications
122	Plasma-enhanced atomic layer deposition and etching of high-k gadolinium oxide
123	Plasma-enhanced atomic layer deposition of barium titanate with aluminum incorporation
124	Plasma-enhanced atomic layer deposition of BaTiO3
125	Plasma-Enhanced Atomic Layer Deposition of SiN-AlN Composites for Ultra Low Wet Etch Rates in Hydrofluoric Acid
126	Plasma-Enhanced Atomic Layer Deposition of SrTa2O6 Thin Films Using Sr[Ta(OC2H5)5(OC2H4OCH3)]2 as Precursor
127	Plasma-Enhanced Atomic Layer Deposition of TiO2 and Al-Doped TiO2 Films Using N2O and O2 Reactants
128	Plasma-enhanced atomic layer deposition of titanium oxynitrides films: A comparative spectroscopic and electrical study
129	Plasma-Enhanced Atomic-Layer Deposition of a HfO2 Gate Dielectric
130	Post Plasma Oxidation Processed ALD Al2O3/Hf1-xZrxO2 Thin Films on Ge Substrates: Reliability
131	Practical Challenges of Processing III-Nitride/Graphene/SiC Devices
132	Properties of HfAlO film deposited by plasma enhanced atomic layer deposition
133	Properties of HfLaO MOS capacitor deposited on SOI with plasma enhanced atomic layer deposition
134	Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
135	Pulse plasma assisted atomic layer deposition of W–C–N thin films for Cu interconnects
136	Radical Enhanced Atomic Layer Deposition of Tantalum Oxide - Thesis Coverage
137	Radical Enhanced Atomic Layer Deposition of Titanium Dioxide - Thesis Coverage
138	Remote Plasma ALD of SrTiO3 Using Cyclopentadienlyl-Based Ti and Sr Precursors
139	Remote plasma atomic layer deposited Al2O3 4H-SiC MOS capacitor with remote H2 plasma passivation and post metallization annealing
140	Remote Plasma Atomic Layer Deposition of HfO2 Thin Films Using the Alkoxide Precursor Hf(mp)4
141	Role of reactive gas on the structure and properties of titanium nitride films grown by plasma enhanced atomic layer deposition
142	Rutile-structured TiO2 deposited by plasma enhanced atomic layer deposition using tetrakis(dimethylamino)titanium precursor on in-situ oxidized Ru electrode
143	Selective deposition of Ta2O5 by adding plasma etching super-cycles in plasma enhanced atomic layer deposition steps
144	Structural and Electrical Analysis of Thin Interface Control Layers of MgO or Al2O3 Deposited by Atomic Layer Deposition and Incorporated at the high-k/III-V Interface of MO2/InxGa1-xAs (M = Hf|Zr, x = 0|0.53) Gate Stacks
145	Structural and electrical properties of ultra-thin high-k ZrO2 film on nitride passivated Ge(100) prepared by PEALD
146	Structural, electrical, and optical properties of transparent gallium oxide thin films grown by plasma-enhanced atomic layer deposition
147	Structural, optical, electrical and resistive switching properties of ZnO thin films deposited by thermal and plasma-enhanced atomic layer deposition
148	Sub-0.5 nm Equivalent Oxide Thickness Scaling for Si-Doped Zr1-xHfxO2 Thin Film without Using Noble Metal Electrode
149	Suppression of interfacial layer in high-K gate stack with crystalline high-K dielectric and AlN buffer layer structure
150	Tailoring the Electrical Properties of HfO2 MOS-Devices by Aluminum Doping
151	Tetragonal Zirconia Stabilization by Metal Addition for Metal-Insulator-Metal Capacitor Applications
152	The effect of plasma power on the properties of low-temperature silicon nitride deposited by RPALD for a gate spacer
153	The Effects of Radio Frequency Plasma Power on Al2O3 Films Deposited at Room-Temperature by Remote Plasma Atomic Layer Deposition
154	The Formation of an Almost Full Atomic Monolayer via Surface Modification by N2O-Plasma in Atomic Layer Deposition of ZrO2 Thin Films
155	The influence of surface preparation on low temperature HfO2 ALD on InGaAs (001) and (110) surfaces
156	Thermal and Plasma-Enhanced ALD of Ta and Ti Oxide Thin Films from Alkylamide Precursors
157	Thin effective oxide thickness (~0.5 nm) and low leakage current gate dielectric for Ge MOS devices by plasma nitrided Al2O3 intermediate layer
158	Three dimensional ALD of TiO2 for in-vivo biomedical sensor applications
159	TiO2/Al2O3/TiO2 Nanolaminated Thin Films for DRAM Capacitor Deposited by Plasma-Enhanced Atomic Layer Deposition
160	Ultra low density of interfacial traps with mixed thermal and plasma enhanced ALD of high-k gate dielectrics
161	Very high frequency plasma reactant for atomic layer deposition
162	ZrO2 Gate Dielectric Deposited by Plasma-Enhanced Atomic Layer Deposition Method
163	ZrO2 Thin Film Deposition on TiN by Plasma Enhanced Atomic Layer Deposition Using Cyclopentadienyltris(dimetylamino)zirconium

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