Publication Information

Title:
Characteristics of TiO2 Films Prepared by ALD With and Without Plasma
Type:
Journal
Info:
Electrochemical and Solid-State Letters, 7 (11) F73-F76 (2004)
Date:
2004-04-22

Author Information

Name Institution
Jung Wook LimElectronics and Telecommunication Research Institute, (ETRI)
Sun Jin YunElectronics and Telecommunication Research Institute, (ETRI)
Jin Ho LeeElectronics and Telecommunication Research Institute, (ETRI)

Films

Thermal TiO2


Plasma TiO2


Plasma TiO2


Film/Plasma Properties

Characteristic: Thickness
Analysis: -

Characteristic: Uniformity
Analysis: -

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Interfacial Layer
Analysis: TEM, Transmission Electron Microscope

Characteristic: Dielectric Constant, Permittivity
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements

Characteristic: Breakdown Voltage
Analysis: I-V, Current-Voltage Measurements

Substrates

Silicon

Keywords

Plasma vs Thermal Comparison

Notes

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