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Characteristics of TiO2 Films Prepared by ALD With and Without Plasma
Type:
Journal
Info:
Electrochemical and Solid-State Letters, 7 (11) F73-F76 (2004)
Date:
2004-04-22
Author Information
| Name | Institution |
|---|---|
| Jung Wook Lim | Electronics and Telecommunication Research Institute, (ETRI) |
| Sun Jin Yun | Electronics and Telecommunication Research Institute, (ETRI) |
| Jin Ho Lee | Electronics and Telecommunication Research Institute, (ETRI) |
Films
Thermal TiO2
Plasma TiO2
Plasma TiO2
Film/Plasma Properties
Characteristic: Thickness
Analysis: -
Characteristic: Uniformity
Analysis: -
Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Interfacial Layer
Analysis: TEM, Transmission Electron Microscope
Characteristic: Dielectric Constant, Permittivity
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Characteristic: Breakdown Voltage
Analysis: I-V, Current-Voltage Measurements
Substrates
| Silicon |
Notes
| 1234 |