Atomic Layer Deposition: An Enabling Technology for Microelectronic Device Manufacturing
Type:
Conference Proceedings
Info:
2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference
Date:
2007-11-06
Author Information
| Name | Institution |
|---|---|
| Fourmun Lee | ASM America Inc. |
| Steven Marcus | ASM America Inc. |
| Eric Shero | ASM America Inc. |
| Glen Wilk | ASM America Inc. |
| Johan Swerts | ASM America Inc. |
| Jan Willem Maes | ASM America Inc. |
| Tom Blomberg | ASM America Inc. |
| Annelies Delabie | IMEC |
| Mickaël Gros-Jean | STMicroelectronics |
| Emilie Deloffre | STMicroelectronics |
Films
Thermal HfO2
Thermal HfSiOx
Plasma Ta2O5
Thermal Al2O3
Film/Plasma Properties
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Characteristic: EOT, Equivalent Oxide Thickness
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Density
Analysis: -
Characteristic: Porosity
Analysis: -
Characteristic: Thickness
Analysis: -
Characteristic: Chemical Composition, Impurities
Analysis: -
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: -
Substrates
Notes
| 1610 |