Remote Plasma Atomic Layer Deposition of HfO2 Thin Films Using the Alkoxide Precursor Hf(mp)4
Type:
Journal
Info:
Electrochemical and Solid-State Letters, 9 (6) G200-G203 (2006)
Date:
2006-02-02
Author Information
Name | Institution |
---|---|
Seokhoon Kim | Hanyang University |
Jinwoo Kim | Hanyang University |
Jihoon Choi | Hanyang University |
Hyunseok Kang | Hanyang University |
Hyeongtag Jeon | Hanyang University |
Wontae Cho | Korea Research Institute of Chemical Technology |
Ki-Seok An | Korea Research Institute of Chemical Technology |
Taek-Mo Chung | Korea Research Institute of Chemical Technology |
Yunsoo Kim | Korea Research Institute of Chemical Technology |
Choelhwyi Bae | Samsung Electronics Co. |
Films
Plasma HfO2
Plasma HfO2
Film/Plasma Properties
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Characteristic: EOT, Equivalent Oxide Thickness
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Substrates
Si(100) |
Notes
1176 |