Plasma-Enhanced Atomic Layer Deposition of TiO2 and Al-Doped TiO2 Films Using N2O and O2 Reactants

Type:
Journal
Info:
Journal of The Electrochemical Society, 156 (9) G138-G143 (2009)
Date:
2009-06-05

Author Information

Name Institution
Gyu-Jin ChoiSeoul National University
Seong Keun KimSeoul National University
Seok-Jun WonSeoul National University
Hyeong Joon KimSeoul National University
Cheol Seong HwangSeoul National University

Films

Plasma TiO2


Plasma TiO2




Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope

Characteristic: Areal Density
Analysis: XRF, X-Ray Fluorescence

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction

Characteristic: EOT, Equivalent Oxide Thickness
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements

Substrates

Ru

Notes

754