Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

Contact us for more information.


Adhesion Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Adhesion returned 31 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
2Direct Plating of Cu on Pd Plasma Enhanced Atomic Layer Deposition Coated TaN Barrier
3Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
4Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
5Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer
6Ag films grown by remote plasma enhanced atomic layer deposition on different substrates
7Copper-ALD Seed Layer as an Enabler for Device Scaling
8Plasma-enhanced atomic layer deposition for antireflection coatings using SiO2 as low-refractive index material
9In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
10Atomic Layer Deposition of NiO to Produce Active Material for Thin-Film Lithium-Ion Batteries
11Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
12PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
13Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper
14Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide
15Antireflection Coating on PMMA Substrates by Atomic Layer Deposition
16Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
17Photocatalytic functional coatings of TiO2 thin films on polymer substrate by plasma enhanced atomic layer deposition
18Low-temperature (≤200°C) plasma enhanced atomic layer deposition of dense titanium nitride thin films
19Ultra-Thin Aluminium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition for Corrosion Protection
20Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
21Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
22Capacitance spectroscopy of gate-defined electronic lattices
23Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors
24Plasma Enhanced Atomic Layer Deposition of Ru-Ta composite film as a Seed Layer for CVD Cu filling
25Comparison of mechanical properties and composition of magnetron sputter and plasma enhanced atomic layer deposition aluminum nitride films
26Mechanical properties of thin-film Parylene-metal-Parylene devices
27Hydrogen plasma-enhanced atomic layer deposition of copper thin films
28Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
29Ta-rich atomic layer deposition TaN adhesion layer for Cu interconnects by means of plasma-enhanced atomic layer deposition
30Designing Multifunctional Cobalt Oxide Layers for Efficient and Stable Electrochemical Oxygen Evolution
31High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating