Adhesion Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Adhesion returned 31 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors
2Designing Multifunctional Cobalt Oxide Layers for Efficient and Stable Electrochemical Oxygen Evolution
3Comparison of mechanical properties and composition of magnetron sputter and plasma enhanced atomic layer deposition aluminum nitride films
4Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
5Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
6Copper-ALD Seed Layer as an Enabler for Device Scaling
7Antireflection Coating on PMMA Substrates by Atomic Layer Deposition
8Capacitance spectroscopy of gate-defined electronic lattices
9Plasma-enhanced atomic layer deposition for antireflection coatings using SiO2 as low-refractive index material
10Hydrogen plasma-enhanced atomic layer deposition of copper thin films
11Atomic Layer Deposition of NiO to Produce Active Material for Thin-Film Lithium-Ion Batteries
12Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
13Low-temperature (≤200°C) plasma enhanced atomic layer deposition of dense titanium nitride thin films
14Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
15Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
16Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide
17Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
18Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
19Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer
20PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
21Ag films grown by remote plasma enhanced atomic layer deposition on different substrates
22In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
23Mechanical properties of thin-film Parylene-metal-Parylene devices
24Ultra-Thin Aluminium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition for Corrosion Protection
25Photocatalytic functional coatings of TiO2 thin films on polymer substrate by plasma enhanced atomic layer deposition
26Ta-rich atomic layer deposition TaN adhesion layer for Cu interconnects by means of plasma-enhanced atomic layer deposition
27Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
28Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper
29High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
30Plasma Enhanced Atomic Layer Deposition of Ru-Ta composite film as a Seed Layer for CVD Cu filling
31Direct Plating of Cu on Pd Plasma Enhanced Atomic Layer Deposition Coated TaN Barrier