Adhesion Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Adhesion returned 31 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
2Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
3Ultra-Thin Aluminium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition for Corrosion Protection
4Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer
5PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
6Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
7Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors
8Comparison of mechanical properties and composition of magnetron sputter and plasma enhanced atomic layer deposition aluminum nitride films
9In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
10Plasma Enhanced Atomic Layer Deposition of Ru-Ta composite film as a Seed Layer for CVD Cu filling
11Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper
12Photocatalytic functional coatings of TiO2 thin films on polymer substrate by plasma enhanced atomic layer deposition
13Antireflection Coating on PMMA Substrates by Atomic Layer Deposition
14Designing Multifunctional Cobalt Oxide Layers for Efficient and Stable Electrochemical Oxygen Evolution
15Capacitance spectroscopy of gate-defined electronic lattices
16Hydrogen plasma-enhanced atomic layer deposition of copper thin films
17Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
18Ag films grown by remote plasma enhanced atomic layer deposition on different substrates
19Direct Plating of Cu on Pd Plasma Enhanced Atomic Layer Deposition Coated TaN Barrier
20Mechanical properties of thin-film Parylene-metal-Parylene devices
21Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
22Copper-ALD Seed Layer as an Enabler for Device Scaling
23Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide
24Plasma-enhanced atomic layer deposition for antireflection coatings using SiO2 as low-refractive index material
25Low-temperature (≤200°C) plasma enhanced atomic layer deposition of dense titanium nitride thin films
26High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
27Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
28Atomic Layer Deposition of NiO to Produce Active Material for Thin-Film Lithium-Ion Batteries
29Ta-rich atomic layer deposition TaN adhesion layer for Cu interconnects by means of plasma-enhanced atomic layer deposition
30Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
31Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals