Adhesion Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Adhesion returned 31 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
2Photocatalytic functional coatings of TiO2 thin films on polymer substrate by plasma enhanced atomic layer deposition
3Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
4Low-temperature (≤200°C) plasma enhanced atomic layer deposition of dense titanium nitride thin films
5Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
6Designing Multifunctional Cobalt Oxide Layers for Efficient and Stable Electrochemical Oxygen Evolution
7Ag films grown by remote plasma enhanced atomic layer deposition on different substrates
8Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
9Ultra-Thin Aluminium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition for Corrosion Protection
10Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors
11Hydrogen plasma-enhanced atomic layer deposition of copper thin films
12Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper
13Comparison of mechanical properties and composition of magnetron sputter and plasma enhanced atomic layer deposition aluminum nitride films
14Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
15Capacitance spectroscopy of gate-defined electronic lattices
16Atomic Layer Deposition of NiO to Produce Active Material for Thin-Film Lithium-Ion Batteries
17PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
18Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
19Direct Plating of Cu on Pd Plasma Enhanced Atomic Layer Deposition Coated TaN Barrier
20Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
21High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
22Mechanical properties of thin-film Parylene-metal-Parylene devices
23Plasma-enhanced atomic layer deposition for antireflection coatings using SiO2 as low-refractive index material
24Copper-ALD Seed Layer as an Enabler for Device Scaling
25Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer
26Antireflection Coating on PMMA Substrates by Atomic Layer Deposition
27Ta-rich atomic layer deposition TaN adhesion layer for Cu interconnects by means of plasma-enhanced atomic layer deposition
28Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide
29In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
30Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
31Plasma Enhanced Atomic Layer Deposition of Ru-Ta composite film as a Seed Layer for CVD Cu filling