Adhesion Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Adhesion returned 30 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Atomic Layer Deposition of NiO to Produce Active Material for Thin-Film Lithium-Ion Batteries
2Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
3Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper
4Ag films grown by remote plasma enhanced atomic layer deposition on different substrates
5Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer
6Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
7Photocatalytic functional coatings of TiO2 thin films on polymer substrate by plasma enhanced atomic layer deposition
8Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide
9Low-temperature (≤200°C) plasma enhanced atomic layer deposition of dense titanium nitride thin films
10High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
11Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
12Plasma-enhanced atomic layer deposition for antireflection coatings using SiO2 as low-refractive index material
13PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
14Plasma Enhanced Atomic Layer Deposition of Ru-Ta composite film as a Seed Layer for CVD Cu filling
15Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
16Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
17Antireflection Coating on PMMA Substrates by Atomic Layer Deposition
18Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
19Designing Multifunctional Cobalt Oxide Layers for Efficient and Stable Electrochemical Oxygen Evolution
20Capacitance spectroscopy of gate-defined electronic lattices
21Copper-ALD Seed Layer as an Enabler for Device Scaling
22In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
23Direct Plating of Cu on Pd Plasma Enhanced Atomic Layer Deposition Coated TaN Barrier
24Ta-rich atomic layer deposition TaN adhesion layer for Cu interconnects by means of plasma-enhanced atomic layer deposition
25Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
26Ultra-Thin Aluminium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition for Corrosion Protection
27Comparison of mechanical properties and composition of magnetron sputter and plasma enhanced atomic layer deposition aluminum nitride films
28Mechanical properties of thin-film Parylene-metal-Parylene devices
29Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors
30Hydrogen plasma-enhanced atomic layer deposition of copper thin films