Diffusion Barrier Properties Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Diffusion Barrier Properties returned 35 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
2An efficient PE-ALD process for TiO2 thin films employing a new Ti-precursor
3Atomic layer deposited Al2O3 and parylene C dual-layer encapsulation for biomedical implantable devices
4Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
5Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
6Atomic layer deposition of titanium nitride from TDMAT precursor
7Biosensor properties of SOI nanowire transistors with a PEALD Al2O3 dielectric protective layer
8Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
9Deposition of Al2O3 by Using ECR-ALD for Organic Substrate Devices
10Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
11Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition
12Diffusion barrier properties of TaNx films prepared by plasma enhanced atomic layer deposition from PDMAT with N2 or NH3 plasma
13Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
14Effect of an Al2O3/TiO2 Passivation Layer on the Performance of Amorphous Zinc-Tin Oxide Thin-Film Transistors
15Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
16Growth Kinetics and Crystallization Behavior of TiO2 Films Prepared by Plasma Enhanced Atomic Layer Deposition
17Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
18Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
19Integration of plasmonic Ag nanoparticles as a back reflector in ultra-thin Cu(In,Ga)Se2 solar cells
20Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
21Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
22Moisture barrier and chemical corrosion protection of silver-based telescope mirrors using aluminum oxide films by plasma-enhanced atomic layer deposition
23Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
24Plasma-assisted ALD to functionalize PET: towards new generation flexible gadgets
25Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
26Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
27Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
28Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
29Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
30Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
31Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
32Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
33Ru thin film grown on TaN by plasma enhanced atomic layer deposition
34The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
35The physical properties of cubic plasma-enhanced atomic layer deposition TaN films


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