Diffusion Barrier Properties Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Diffusion Barrier Properties returned 41 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1From Precursor Chemistry to Gas Sensors: Plasma-Enhanced Atomic Layer Deposition Process Engineering for Zinc Oxide Layers from a Nonpyrophoric Zinc Precursor for Gas Barrier and Sensor Applications
2Atomic layer deposited Al2O3 and parylene C dual-layer encapsulation for biomedical implantable devices
3Moisture barrier and chemical corrosion protection of silver-based telescope mirrors using aluminum oxide films by plasma-enhanced atomic layer deposition
4Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
5Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
6Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
7Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
8The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
9Plasma-assisted ALD to functionalize PET: towards new generation flexible gadgets
10Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
11Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition
12Atomic layer deposition of titanium nitride from TDMAT precursor
13Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
14Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
15Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
16An efficient PE-ALD process for TiO2 thin films employing a new Ti-precursor
17Growth Kinetics and Crystallization Behavior of TiO2 Films Prepared by Plasma Enhanced Atomic Layer Deposition
18Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
19Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
20Integration of plasmonic Ag nanoparticles as a back reflector in ultra-thin Cu(In,Ga)Se2 solar cells
21Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
22Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
23Ru thin film grown on TaN by plasma enhanced atomic layer deposition
24Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
25Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
26The physical properties of cubic plasma-enhanced atomic layer deposition TaN films
27Diffusion barrier properties of TaNx films prepared by plasma enhanced atomic layer deposition from PDMAT with N2 or NH3 plasma
28TaCN growth with PDMAT and H2/Ar plasma by plasma enhanced atomic layer deposition
29Deposition of Al2O3 by Using ECR-ALD for Organic Substrate Devices
30Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
31Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
32Nanometer-Thick Conformal Pore Sealing of Self-Assembled Mesoporous Silica by Plasma-Assisted Atomic Layer Deposition
33Biosensor properties of SOI nanowire transistors with a PEALD Al2O3 dielectric protective layer
34A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
35Effect of an Al2O3/TiO2 Passivation Layer on the Performance of Amorphous Zinc-Tin Oxide Thin-Film Transistors
36Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
37Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
38Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
39Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
40Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
41Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects