Diffusion Barrier Properties Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Diffusion Barrier Properties returned 41 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1From Precursor Chemistry to Gas Sensors: Plasma-Enhanced Atomic Layer Deposition Process Engineering for Zinc Oxide Layers from a Nonpyrophoric Zinc Precursor for Gas Barrier and Sensor Applications
2A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
3An efficient PE-ALD process for TiO2 thin films employing a new Ti-precursor
4Diffusion barrier properties of TaNx films prepared by plasma enhanced atomic layer deposition from PDMAT with N2 or NH3 plasma
5Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
6Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
7Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
8Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
9Atomic layer deposited Al2O3 and parylene C dual-layer encapsulation for biomedical implantable devices
10Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
11Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
12Deposition of Al2O3 by Using ECR-ALD for Organic Substrate Devices
13Nanometer-Thick Conformal Pore Sealing of Self-Assembled Mesoporous Silica by Plasma-Assisted Atomic Layer Deposition
14Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
15Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
16Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
17Ru thin film grown on TaN by plasma enhanced atomic layer deposition
18Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
19Biosensor properties of SOI nanowire transistors with a PEALD Al2O3 dielectric protective layer
20Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
21Atomic layer deposition of titanium nitride from TDMAT precursor
22Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition
23The physical properties of cubic plasma-enhanced atomic layer deposition TaN films
24Plasma-assisted ALD to functionalize PET: towards new generation flexible gadgets
25Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
26TaCN growth with PDMAT and H2/Ar plasma by plasma enhanced atomic layer deposition
27Growth Kinetics and Crystallization Behavior of TiO2 Films Prepared by Plasma Enhanced Atomic Layer Deposition
28Effect of an Al2O3/TiO2 Passivation Layer on the Performance of Amorphous Zinc-Tin Oxide Thin-Film Transistors
29Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
30Moisture barrier and chemical corrosion protection of silver-based telescope mirrors using aluminum oxide films by plasma-enhanced atomic layer deposition
31Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
32Integration of plasmonic Ag nanoparticles as a back reflector in ultra-thin Cu(In,Ga)Se2 solar cells
33Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
34The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
35Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
36Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
37Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
38Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
39Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
40Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
41Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu