Diffusion Barrier Properties Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Diffusion Barrier Properties returned 41 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
2Atomic layer deposition of titanium nitride from TDMAT precursor
3TaCN growth with PDMAT and H2/Ar plasma by plasma enhanced atomic layer deposition
4The physical properties of cubic plasma-enhanced atomic layer deposition TaN films
5Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
6Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
7The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
8Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
9Moisture barrier and chemical corrosion protection of silver-based telescope mirrors using aluminum oxide films by plasma-enhanced atomic layer deposition
10Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
11Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
12Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
13Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
14Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
15Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
16Diffusion barrier properties of TaNx films prepared by plasma enhanced atomic layer deposition from PDMAT with N2 or NH3 plasma
17Plasma-assisted ALD to functionalize PET: towards new generation flexible gadgets
18Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
19Integration of plasmonic Ag nanoparticles as a back reflector in ultra-thin Cu(In,Ga)Se2 solar cells
20Ru thin film grown on TaN by plasma enhanced atomic layer deposition
21Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
22Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
23Growth Kinetics and Crystallization Behavior of TiO2 Films Prepared by Plasma Enhanced Atomic Layer Deposition
24An efficient PE-ALD process for TiO2 thin films employing a new Ti-precursor
25Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
26Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
27A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
28Biosensor properties of SOI nanowire transistors with a PEALD Al2O3 dielectric protective layer
29Effect of an Al2O3/TiO2 Passivation Layer on the Performance of Amorphous Zinc-Tin Oxide Thin-Film Transistors
30Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
31Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
32Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
33Nanometer-Thick Conformal Pore Sealing of Self-Assembled Mesoporous Silica by Plasma-Assisted Atomic Layer Deposition
34Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition
35Deposition of Al2O3 by Using ECR-ALD for Organic Substrate Devices
36Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
37Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
38Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
39Atomic layer deposited Al2O3 and parylene C dual-layer encapsulation for biomedical implantable devices
40From Precursor Chemistry to Gas Sensors: Plasma-Enhanced Atomic Layer Deposition Process Engineering for Zinc Oxide Layers from a Nonpyrophoric Zinc Precursor for Gas Barrier and Sensor Applications
41Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers