Diffusion Barrier Properties Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Diffusion Barrier Properties returned 31 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

Number	Title
1	A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
2	An efficient PE-ALD process for TiO2 thin films employing a new Ti-precursor
3	Atomic layer deposited Al2O3 and parylene C dual-layer encapsulation for biomedical implantable devices
4	Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
5	Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
6	Atomic layer deposition of titanium nitride from TDMAT precursor
7	Biosensor properties of SOI nanowire transistors with a PEALD Al2O3 dielectric protective layer
8	Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
9	Deposition of Al2O3 by Using ECR-ALD for Organic Substrate Devices
10	Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition
11	Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
12	Effect of an Al2O3/TiO2 Passivation Layer on the Performance of Amorphous Zinc-Tin Oxide Thin-Film Transistors
13	Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
14	Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
15	Integration of plasmonic Ag nanoparticles as a back reflector in ultra-thin Cu(In,Ga)Se2 solar cells
16	Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
17	Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
18	Moisture barrier and chemical corrosion protection of silver-based telescope mirrors using aluminum oxide films by plasma-enhanced atomic layer deposition
19	Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
20	Plasma-assisted ALD to functionalize PET: towards new generation flexible gadgets
21	Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
22	Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
23	Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
24	Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
25	Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
26	Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
27	Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
28	Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
29	Ru thin film grown on TaN by plasma enhanced atomic layer deposition
30	The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
31	The physical properties of cubic plasma-enhanced atomic layer deposition TaN films

Shortcuts

© 2014-2019 plasma-ald.com