Diffusion Barrier Properties Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Diffusion Barrier Properties returned 41 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

1Plasma-assisted ALD to functionalize PET: towards new generation flexible gadgets
2Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
3Integration of plasmonic Ag nanoparticles as a back reflector in ultra-thin Cu(In,Ga)Se2 solar cells
4Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
5Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
6Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition
7Biosensor properties of SOI nanowire transistors with a PEALD Al2O3 dielectric protective layer
8Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
9Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
10Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
11Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
12Moisture barrier and chemical corrosion protection of silver-based telescope mirrors using aluminum oxide films by plasma-enhanced atomic layer deposition
13Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
14Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
15Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
16Atomic layer deposited Al2O3 and parylene C dual-layer encapsulation for biomedical implantable devices
17Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
18Atomic layer deposition of titanium nitride from TDMAT precursor
19Ru thin film grown on TaN by plasma enhanced atomic layer deposition
20Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
21Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
22Nanometer-Thick Conformal Pore Sealing of Self-Assembled Mesoporous Silica by Plasma-Assisted Atomic Layer Deposition
23Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
24Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
25Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
26Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
27Effect of an Al2O3/TiO2 Passivation Layer on the Performance of Amorphous Zinc-Tin Oxide Thin-Film Transistors
28From Precursor Chemistry to Gas Sensors: Plasma-Enhanced Atomic Layer Deposition Process Engineering for Zinc Oxide Layers from a Nonpyrophoric Zinc Precursor for Gas Barrier and Sensor Applications
29Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
30Growth Kinetics and Crystallization Behavior of TiO2 Films Prepared by Plasma Enhanced Atomic Layer Deposition
31TaCN growth with PDMAT and H2/Ar plasma by plasma enhanced atomic layer deposition
32The physical properties of cubic plasma-enhanced atomic layer deposition TaN films
33Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
34A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
35An efficient PE-ALD process for TiO2 thin films employing a new Ti-precursor
36Diffusion barrier properties of TaNx films prepared by plasma enhanced atomic layer deposition from PDMAT with N2 or NH3 plasma
37Deposition of Al2O3 by Using ECR-ALD for Organic Substrate Devices
38Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
39Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
40Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
41The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties