Diffusion Barrier Properties Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Diffusion Barrier Properties returned 31 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
2An efficient PE-ALD process for TiO2 thin films employing a new Ti-precursor
3Atomic layer deposited Al2O3 and parylene C dual-layer encapsulation for biomedical implantable devices
4Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
5Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
6Atomic layer deposition of titanium nitride from TDMAT precursor
7Biosensor properties of SOI nanowire transistors with a PEALD Al2O3 dielectric protective layer
8Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
9Deposition of Al2O3 by Using ECR-ALD for Organic Substrate Devices
10Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition
11Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
12Effect of an Al2O3/TiO2 Passivation Layer on the Performance of Amorphous Zinc-Tin Oxide Thin-Film Transistors
13Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
14Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
15Integration of plasmonic Ag nanoparticles as a back reflector in ultra-thin Cu(In,Ga)Se2 solar cells
16Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
17Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
18Moisture barrier and chemical corrosion protection of silver-based telescope mirrors using aluminum oxide films by plasma-enhanced atomic layer deposition
19Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
20Plasma-assisted ALD to functionalize PET: towards new generation flexible gadgets
21Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
22Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
23Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
24Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
25Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
26Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
27Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
28Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
29Ru thin film grown on TaN by plasma enhanced atomic layer deposition
30The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
31The physical properties of cubic plasma-enhanced atomic layer deposition TaN films


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