Diffusion Barrier Properties Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Diffusion Barrier Properties returned 39 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

Number	Title
1	A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
2	An efficient PE-ALD process for TiO2 thin films employing a new Ti-precursor
3	Atomic layer deposited Al2O3 and parylene C dual-layer encapsulation for biomedical implantable devices
4	Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
5	Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
6	Atomic layer deposition of titanium nitride from TDMAT precursor
7	Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
8	Biosensor properties of SOI nanowire transistors with a PEALD Al2O3 dielectric protective layer
9	Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
10	Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
11	Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
12	Deposition of Al2O3 by Using ECR-ALD for Organic Substrate Devices
13	Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
14	Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition
15	Diffusion barrier properties of TaNx films prepared by plasma enhanced atomic layer deposition from PDMAT with N2 or NH3 plasma
16	Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
17	Effect of an Al2O3/TiO2 Passivation Layer on the Performance of Amorphous Zinc-Tin Oxide Thin-Film Transistors
18	Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
19	Growth Kinetics and Crystallization Behavior of TiO2 Films Prepared by Plasma Enhanced Atomic Layer Deposition
20	Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
21	Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
22	Integration of plasmonic Ag nanoparticles as a back reflector in ultra-thin Cu(In,Ga)Se2 solar cells
23	Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
24	Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
25	Moisture barrier and chemical corrosion protection of silver-based telescope mirrors using aluminum oxide films by plasma-enhanced atomic layer deposition
26	Nanometer-Thick Conformal Pore Sealing of Self-Assembled Mesoporous Silica by Plasma-Assisted Atomic Layer Deposition
27	Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
28	Plasma-assisted ALD to functionalize PET: towards new generation flexible gadgets
29	Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
30	Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
31	Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
32	Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
33	Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
34	Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
35	Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
36	Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
37	Ru thin film grown on TaN by plasma enhanced atomic layer deposition
38	The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
39	The physical properties of cubic plasma-enhanced atomic layer deposition TaN films

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