Wetting Angle Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Wetting Angle returned 20 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Plasma-assisted ALD to functionalize PET: towards new generation flexible gadgets
2Plasma-assisted atomic layer deposition of nickel oxide as hole transport layer for hybrid perovskite solar cells
3Hydrophilic/hydrophobic surface of Al2O3 thin films grown by thermal and plasma-enhanced atomic layer deposition on plasticized polyvinyl chloride (PVC)
4Plasma activation and atomic layer deposition of TiO2 on polypropylene membranes for improved performances of lithium-ion batteries
5Influence of argon plasma on the deposition of Al2O3 film onto the PET surfaces by atomic layer deposition
6Plasma-Assisted ALD of an Al2O3 Permeation Barrier Layer on Plastic
7A Microwave Driven PE-ALD for Ultrathin Al2O3/ZnO Synthesis over Perovskite Layer
8Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors
9Deposition and Characterization of RP-ALD SiO2 Thin Films with Different Oxygen Plasma Powers
10Atomic Layer Deposited Electron Transport Layers in Efficient Organometallic Halide Perovskite Devices
11Radical Enhanced Atomic Layer Deposition of Titanium Dioxide
12Degradation of the deposition blocking layer during area-selective plasma-enhanced atomic layer deposition of cobalt
13Self-assembled monolayers as a defect sealant of Al2O3 barrier layers grown by atomic layer deposition
14Plasma-enhanced atomic layer deposition: a gas-phase route to hydrophilic, glueable polytetrafluoroethylene
15Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating
16Enhanced Barrier Performance of Engineered Paper by Atomic Layer Deposited Al2O3 Thin Films
17Influence of the polymeric substrate on the water permeation of alumina barrier films deposited by atomic layer deposition
18Wetting transitions of polymers via thermal and plasma enhanced atomic layer depositions
19Enhancing the Wettability of High Aspect-Ratio Through-Silicon Vias Lined With LPCVD Silicon Nitride or PE-ALD Titanium Nitride for Void-Free Bottom-Up Copper Electroplating
20Impact of interface materials on side permeation in indirect encapsulation of organic electronics