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The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

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Impact of interface materials on side permeation in indirect encapsulation of organic electronics

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 38, 033203 (2020)
Date:
2020-02-20

Author Information

Name Institution
Ankit Kumar SinghGeorgia Institute of Technology
Wen-Fang ChouGeorgia Institute of Technology
Xiaojia JiaGeorgia Institute of Technology
Cheng-Yin WangGeorgia Institute of Technology
Canek Fuentes-HernandezGeorgia Institute of Technology
Bernard KippelenGeorgia Institute of Technology
Samuel GrahamGeorgia Institute of Technology

Films

Plasma Al2O3



Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Wetting Angle
Analysis: Contact Angle Measurement

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Calcium Test

Substrates

PEN, Polyethylene Napthalate
Silicon

Notes

1464