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An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

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Plasma-Assisted ALD of an Al2O3 Permeation Barrier Layer on Plastic

Type:
Journal
Info:
Plasma Science and Technology, Vol.14, No.2, 2012
Date:
2011-11-04
DOI:
http://dx.doi.org/10.1088/1009-0630/14/2/09

Author Information

Name Institution
Wenwen LeiBeijing Institute of Graphic Communication
Xingcun LiBeijing Institute of Graphic Communication
Qiang ChenBeijing Institute of Graphic Communication
Zhengduo WangBeijing Institute of Graphic Communication

Films

Plasma Al2O3

Hardware used: Custom Direct Capacitively Coupled Plasma
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
Where to buy precursor
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 25C

Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry
Diagnostic: Horiba Jobin Yvon

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: Veeco AFM

Characteristic: Oxygen Transmission Rate (OTR)
Analysis: Oxygen Transmission Rate (OTR)
Diagnostic: Systech Illinois Oxygen permeation analyzer 8001

Characteristic: Wetting Angle
Analysis: Contact Angle Measurement
Diagnostic: Kruss

Substrates

PET, Polyethylene Terephthalate

Notes

661