Cu(TMHD)2, bis(2,2,6,6-tetramethyl-3,5-heptanedionate) copper, CAS# 14040-05-2

Where to buy

NumberVendorLink
1Ereztech2,2,6,6-Tetramethyl-3,5-heptanedionate(II) copper

Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 2 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
2Radical Enhanced Atomic Layer Deposition of Metals and Oxides