Publication Information

Title:
Low temperature hydrogen plasma-assisted atomic layer deposition of copper studied using in situ infrared reflection absorption spectroscopy
Type:
Journal
Info:
J. Vac. Sci. Technol. A 32(1), Jan/Feb 2014, 01A108
Date:
2013-11-04

Author Information

Name Institution
Rohan P. ChaukulkarColorado School of Mines
Nick F. W. ThissenEindhoven University of Technology
Vikrant R. RaiColorado School of Mines
Sumit AgarwalColorado School of Mines

Films

Plasma Cu


Plasma Cu


Film/Plasma Properties

Characteristic: Surface Reactions
Analysis: IRAS, Infrared Reflection Absorption Spectroscopy

Substrates

Al2O3

Keywords

Interconnect
PEALD Film Development

Notes

10