Publication Information

Title: Low temperature hydrogen plasma-assisted atomic layer deposition of copper studied using in situ infrared reflection absorption spectroscopy

Type: Journal

Info: J. Vac. Sci. Technol. A 32(1), Jan/Feb 2014, 01A108

Date: 2013-11-04

DOI: http://dx.doi.org/10.1116/1.4831915

Author Information

Name

Institution

Colorado School of Mines

Eindhoven University of Technology

Colorado School of Mines

Colorado School of Mines

Films

Plasma Cu using Custom

Deposition Temperature = 80C

155640-85-0

1333-74-0

Plasma Cu using Custom

Deposition Temperature = 80C

155640-85-0

7782-39-0

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Surface Reactions

IRAS, Infrared Reflection Absorption Spectroscopy

Custom

Substrates

Al2O3

Keywords

Interconnect

PEALD Film Development

Notes

10



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