Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

Contact us for more information.


Silicon nanowire networks for multi-stage thermoelectric modules

Type:
Journal
Info:
Energy Conversion and Management, Volume 96, 2015, Pages 100 - 104
Date:
2015-02-16
DOI:
http://dx.doi.org/10.1016/j.enconman.2015.02.050

Author Information

Name Institution
Kate J. NorrisUniversity of California - Santa Cruz
Matthew P. GarrettUniversity of California - Santa Cruz
Junce ZhangUniversity of California - Santa Cruz
Elane ColemanStructured Materials Industries, Inc.
Gary S. TompaStructured Materials Industries, Inc.
Nobuhiko P. KobayashiUniversity of California - Santa Cruz

Films

Plasma TiN

Hardware used: Unknown
TiCl4, Titanium Tetrachloride
CAS#: 7550-45-0
Where to buy precursor
N2, Nitrogen
CAS#: 7727-37-9
Deposition Temperature = 300C

Film/Plasma Properties

Substrates

Cu

Notes

Paper available in on-line thesis
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