2021 Year in Review

The publication database currently has 1616 entries.

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202 Films Compositions

272 Precursors and Plasma Gases

77 Deposition Hardwares

250 Film and Plasma Characteristics

88 Theses

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Tailoring angular selectivity in SiO₂ slanted columnar thin films using atomic layer deposition of titanium nitride Characterization of Molybdenum Oxide Thin Films Grown by Atomic Layer Deposition Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition

Search 1616 plasma ALD publications by:

202 Films Compositions

272 Precursors and Plasma Gases

77 Deposition Hardwares

250 Film and Plasma Characteristics

Stuffing-enabled surface confinement of silanes used as sealing agents on CF₄ plasma-exposed 2.0 p-OSG films

Type:

Journal

Info:

Microelectronic Engineering, Available online 10 November 2014

Date:

2014-11-03

DOI:

http://dx.doi.org/10.1016/j.mee.2014.11.001

Author Information

Name	Institution
Yiting Sun	IMEC

Films

Plasma TiN

Hardware used: Unknown

TDMATi, tetrakis(dimethylamido)titanium, titanium dimethylamide, (Me₂N)₄Ti

CAS#: 3275-24-9

Where to buy precursor

Deposition Temperature Range N/A

Film/Plasma Properties

Substrates

Keywords

Interconnect
Diffusion Barrier

Notes

PEALD TiN for interconnect diffusion barrier application.
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