Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films

Type:
Journal
Info:
Microelectronic Engineering, Available online 10 November 2014
Date:
2014-11-03
DOI:
http://dx.doi.org/10.1016/j.mee.2014.11.001

Author Information

Name Institution
Yiting SunIMEC

Films

Plasma TiN

Hardware used: Unknown
TDMATi, (Me2N)4Ti, [(CH3)2N]4Ti, Tetrakis (DiMethylAmido) Titanium, Titanium Dimethylamide
CAS#: 3275-24-9
Where to buy precursor
Deposition Temperature Range N/A

Film/Plasma Properties

Substrates

Keywords

Interconnect
Diffusion Barrier

Notes

PEALD TiN for interconnect diffusion barrier application.
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