Publication Information

Title: Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films

Type: Journal

Info: Microelectronic Engineering, Available online 10 November 2014

Date: 2014-11-03

DOI: http://dx.doi.org/10.1016/j.mee.2014.11.001

Author Information

Name

Institution

IMEC

Films

Plasma TiN using Unknown

Deposition Temperature Range N/A

3275-24-9

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Substrates

Keywords

Interconnect

Diffusion Barrier

Notes

PEALD TiN for interconnect diffusion barrier application.

289



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