Publication Information

Title:
Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films
Type:
Journal
Info:
Microelectronic Engineering, Available online 10 November 2014
Date:
2014-11-03

Author Information

Name Institution
Yiting SunIMEC

Films


Film/Plasma Properties

Substrates

Keywords

Interconnect
Diffusion Barrier

Notes

PEALD TiN for interconnect diffusion barrier application.
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