Publication Information

Title:
Method of sealing pores in porous low-k SiOC(-H) films fabricated using plasma-assisted atomic layer deposition
Type:
Journal
Info:
Journal of the Korean Physical Society, Vol. 62, No. 8, pp. 1143--1149
Date:
2013-05-08

Author Information

Name Institution
Chang Young KimJeju National University
Hong Seok LeeJeju National University
Chi Kyu ChoiJeju National University
Young Hun YuJeju National University
R. NavamathavanChonbuk National University
Heon Ju LeeJeju National University

Films

Plasma SiCOH


Plasma SiCOH


Film/Plasma Properties

Characteristic: Refractive Index
Analysis: Ellipsometry

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Chemical Composition, Impurities
Analysis: FTIR, Fourier Transform InfraRed spectroscopy

Substrates

Silicon

Keywords

Notes

I am not exactly sure what is going on in the process described in the paper.
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