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Method of sealing pores in porous low-k SiOC(-H) films fabricated using plasma-assisted atomic layer deposition
Type:
Journal
Info:
Journal of the Korean Physical Society, Vol. 62, No. 8, pp. 1143--1149
Date:
2013-05-08
Author Information
| Name | Institution |
|---|---|
| Chang Young Kim | Jeju National University |
| Hong Seok Lee | Jeju National University |
| Chi Kyu Choi | Jeju National University |
| Young Hun Yu | Jeju National University |
| R. Navamathavan | Chonbuk National University |
| Heon Ju Lee | Jeju National University |
Films
Film/Plasma Properties
Characteristic: Refractive Index
Analysis: Ellipsometry
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: FTIR, Fourier Transform InfraRed spectroscopy
Substrates
| Silicon |
Notes
| I am not exactly sure what is going on in the process described in the paper. |
| 614 |