About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Hot-wire assisted ALD of tungsten films: In-situ study of the interplay between CVD, etching, and ALD modes

Type:
Journal
Info:
physica status solidi (a) Volume 212, Issue 7, pages 1607-1614, July 2015
Date:
2015-04-30

Author Information

Name Institution
Mengdi YangUniversity of Twente
Antonius A. I. AarninkUniversity of Twente
Alexey Y. KovalginUniversity of Twente
Rob A. M. WoltersUniversity of Twente
Jurriaan SchmitzUniversity of Twente

Films

Plasma W

Hardware used: Unknown


CAS#: 1333-74-0

Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Substrates

SiO2

Notes

488