Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

Contact us for more information.


Surface Etching of TiO2 Thin Films Using High Density Cl2/Ar Plasma

Type:
Journal
Info:
TRANSACTIONS ON ELECTRICAL AND ELECTRONIC MATERIALS Vol. 16, No. 6, pp. 346-350, December 25, 2015
Date:
2015-11-11
DOI:
http://dx.doi.org/10.4313/TEEM.2015.16.6.346

Author Information

Name Institution
Jong-Chang WooChung-Ang University
Young-Hee JooChung-Ang University
Chang-Il KimChung-Ang University

Films

Plasma TiO2

Hardware used: Unknown
Deposition Temperature = 200C

Film/Plasma Properties

Substrates

Si(100)

Notes

448