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An economical, compact inductively coupled plasma source.

Ideal for:

  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

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Interfaces of high-k dielectrics on GaAs: Their common features and the relationship with Fermi level pinning

Type:
Journal
Info:
Microelectronic Engineering 86 (2009) 1529 - 1535
Date:
2009-03-10

Author Information

Name Institution
Matty CaymaxIMEC
Guy BrammertzIMEC
Annelies DelabieIMEC
Sonja SionckeIMEC
Dennis LinIMEC
Marco ScarrozzaIMEC
Geoffrey PourtoisIMEC
Wei-E WangIMEC
Marc MeurisIMEC
Marc HeynsIMEC

Films

Thermal HfO2





Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: TOF-SIMS, Time of Flight Secondary Ion Mass Spectrometry

Characteristic: Interface Trap Density
Analysis: C-V, Capacitance-Voltage Measurements

Substrates

GaAs

Notes

300C deposition temperatures inferred from text. Might be wrong.
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