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Ru Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Ru films returned 49 record(s).

NumberTitle
1Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
2Reactions of ruthenium cyclopentadienyl precursor in the metal precursor pulse of Ru atomic layer deposition
3Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
4Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
5Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
6Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
7Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
8In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
9In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
10Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
11Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
12Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
13Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
14Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
15Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
16Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
17Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
18Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
19Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
20Non-destructive acoustic metrology and void detection in 3x50μm TSV
21Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
22Texture of atomic layer deposited ruthenium
23Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
24Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
25Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
26Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
27Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
28A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
29Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
30The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
31The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
32Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
33Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
34Near room temperature plasma enhanced atomic layer deposition of ruthenium using the RuO4-precursor and H2-plasma
35Plasma-enhanced atomic layer deposition of ruthenium metal on free-standing carbon nanotube forest for 3D flexible binder-less supercapacitor electrodes
36Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
37High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
38Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
39PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
40Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
41Understanding the EOT-Jg degradation in Ru/SrTiOx/Ru metal-insulator-metal capacitors formed with Ru atomic layer deposition
42Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
43Radical Enhanced Atomic Layer Deposition of Metals and Oxides
44Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
45Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
46Mobile setup for synchrotron based in situ characterization during thermal and plasma-enhanced atomic layer deposition
47Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
48Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
49Ru thin film grown on TaN by plasma enhanced atomic layer deposition