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Ru Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Ru films returned 49 record(s).

NumberTitle
1Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
2Ru thin film grown on TaN by plasma enhanced atomic layer deposition
3Radical Enhanced Atomic Layer Deposition of Metals and Oxides
4Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
5Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
6Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
7Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
8Plasma-enhanced atomic layer deposition of ruthenium metal on free-standing carbon nanotube forest for 3D flexible binder-less supercapacitor electrodes
9The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
10Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
11Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
12Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
13Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
14Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
15Reactions of ruthenium cyclopentadienyl precursor in the metal precursor pulse of Ru atomic layer deposition
16Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
17The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
18Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
19In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
20Non-destructive acoustic metrology and void detection in 3x50μm TSV
21Understanding the EOT-Jg degradation in Ru/SrTiOx/Ru metal-insulator-metal capacitors formed with Ru atomic layer deposition
22Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
23Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
24Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
25Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
26Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
27Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
28Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
29Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
30Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
31A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
32Mobile setup for synchrotron based in situ characterization during thermal and plasma-enhanced atomic layer deposition
33Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
34Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
35Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
36Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
37Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
38Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
39Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
40High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
41Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
42PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
43Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
44Near room temperature plasma enhanced atomic layer deposition of ruthenium using the RuO4-precursor and H2-plasma
45Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
46Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
47In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
48Texture of atomic layer deposited ruthenium
49Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions