Ru Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Ru films returned 49 record(s).

NumberTitle
1The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
2Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
3Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
4Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
5In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
6Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
7Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
8In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
9Understanding the EOT-Jg degradation in Ru/SrTiOx/Ru metal-insulator-metal capacitors formed with Ru atomic layer deposition
10Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
11Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
12Reactions of ruthenium cyclopentadienyl precursor in the metal precursor pulse of Ru atomic layer deposition
13Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
14Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
15Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
16Plasma-enhanced atomic layer deposition of ruthenium metal on free-standing carbon nanotube forest for 3D flexible binder-less supercapacitor electrodes
17Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
18Mobile setup for synchrotron based in situ characterization during thermal and plasma-enhanced atomic layer deposition
19Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
20Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
21Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
22Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
23Ru thin film grown on TaN by plasma enhanced atomic layer deposition
24Texture of atomic layer deposited ruthenium
25Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
26Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
27Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
28Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
29The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
30Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
31Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
32Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
33Non-destructive acoustic metrology and void detection in 3x50μm TSV
34A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
35Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
36PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
37Near room temperature plasma enhanced atomic layer deposition of ruthenium using the RuO4-precursor and H2-plasma
38Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
39Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
40Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
41Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
42High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
43Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
44Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
45Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
46Radical Enhanced Atomic Layer Deposition of Metals and Oxides
47Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
48Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
49Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition