Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
Author Information
| Name | Institution |
|---|---|
| Hyun-Jung Lee | Yeungnam University |
| Tae Eun Hong | Korean Basic Science Institute |
| Soo-Hyun Kim | Yeungnam University |
Films
Film/Plasma Properties
Substrates
| SiO2 |
Notes
| 919 |