About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects

Type:
Journal
Info:
ECS J. Solid State Sci. Technol. 2016 volume 5, issue 5, P256-P263
Date:
2016-02-01

Author Information

Name Institution
K. V. SagiClarkson University
H. P. AmanapuClarkson University
S. R. AletyClarkson University
S. V. BabuClarkson University

Films

Plasma Ru

Hardware used: Unknown


CAS#: 7664-41-7

Plasma TiN


Film/Plasma Properties

Substrates

Silicon
SiO2

Notes

774