Ethylcyclopentadienyl pyrrolyl ruthenium, CAS# 0-0-0

Your search for publications using this chemistry returned 10 record(s).

Number	Title
1	Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
2	Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
3	Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
4	Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
5	Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
6	Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
7	Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
8	High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
9	Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
10	Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications