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Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications

Type:
Journal
Info:
J. Vac. Sci. Technol. B 27(2)., Mar/Apr 2009
Date:
2009-03-20

Author Information

Name Institution
Daniel V. GreenslitState University of New York at Albany
Tonmoy ChakrabortyState University of New York at Albany
Eric T. EisenbraunState University of New York at Albany

Films

Plasma Ru-WCN


Plasma Ru


Plasma WCN


Film/Plasma Properties

Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope

Characteristic: Barrier Characteristics
Analysis: TVS, Triangle Voltage Sweep

Characteristic: Resistivity, Sheet Resistance
Analysis: -

Substrates

SiO2

Notes

115