Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
Info:
J. Vac. Sci. Technol. B 27(2)., Mar/Apr 2009
Author Information
Films
Film/Plasma Properties
Analysis: XPS, X-ray Photoelectron Spectroscopy
Analysis: AFM, Atomic Force Microscopy
Analysis: SEM, Scanning Electron Microscopy
Analysis: RBS, Rutherford Backscattering Spectrometry
Analysis: TEM, Transmission Electron Microscope
Analysis: TEM, Transmission Electron Microscope
Analysis: TVS, Triangle Voltage Sweep
Substrates
Notes