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Eric T. Eisenbraun Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications authored by Eric T. Eisenbraun returned 16 record(s).

NumberTitle
1Hydrogen plasma-enhanced atomic layer deposition of copper thin films
2Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
3Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
4Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
5Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
6Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
7Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics
8PEALD of Copper using New Precursors for Next Generation of Interconnections
9Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
10The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
11Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
12Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
13Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
14Copper-ALD Seed Layer as an Enabler for Device Scaling
15Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
16Plasma-Assisted Atomic Layer Deposition of Conductive Hafnium Nitride Using Tetrakis(ethylmethylamino)hafnium for CMOS Gate Electrode Applications