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Eric T. Eisenbraun Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications authored by Eric T. Eisenbraun returned 16 record(s).

NumberTitle
1Hydrogen plasma-enhanced atomic layer deposition of copper thin films
2Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics
3PEALD of Copper using New Precursors for Next Generation of Interconnections
4Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
5Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
6Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
7Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
8Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
9Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
10Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
11Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
12Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
13The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
14Plasma-Assisted Atomic Layer Deposition of Conductive Hafnium Nitride Using Tetrakis(ethylmethylamino)hafnium for CMOS Gate Electrode Applications
15Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
16Copper-ALD Seed Layer as an Enabler for Device Scaling