Inductively coupled plasma sources from Plasma ALD, LLC.


Ideal for plasma enhanced atomic layer deposition and other surface engineering applications.


Contact us for more information.

Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper

Type:
Journal
Info:
Electrochemical and Solid-State Letters, 11 (5) H107-H110 (2008)
Date:
2008-01-08
DOI:
http://dx.doi.org/10.1149/1.2844207

Author Information

Name Institution
Liqi WuState University of New York at Albany
Eric T. EisenbraunState University of New York at Albany

Films

Plasma Cu

Hardware used: TEL Phoenix CVD cluster tool
copper(II) acetylacetonate, bis(2,4-pentanedionato) copper(II), cupric acetylacetonate, Cu(acac)2
CAS#: 13395-16-9
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature = 85C

Film/Plasma Properties

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: LEO 1550

Characteristic: Continuity
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: LEO 1550

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Diagnostic: JEOL 200CX

Characteristic: Continuity
Analysis: TEM, Transmission Electron Microscope
Diagnostic: JEOL 200CX

Characteristic: Chemical Composition, Impurities
Analysis: NRA, Nuclear Reaction Analysis
Diagnostic: -

Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Diagnostic: Perkin Elmer PHI600

Characteristic: Morphology, Roughness, Topography
Analysis: XRD, X-Ray Diffraction
Diagnostic: Scintag XDS 2000

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: Thermomicroscopes Autoprobe CPResearch system

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Diagnostic: Signatone SYS-301 resistivity probing system

Substrates

SiO2
Ru

Notes

1337