copper(II) acetylacetonate, bis(2,4-pentanedionato) copper(II), cupric acetylacetonate, Cu(acac)₂, CAS# 13395-16-9

Your search for publications using this chemistry returned 6 record(s).

Number	Title
1	Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
2	Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
3	Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
4	Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
5	Radical Enhanced Atomic Layer Deposition of Metals and Oxides
6	Hydrogen plasma-enhanced atomic layer deposition of copper thin films

copper(II) acetylacetonate, bis(2,4-pentanedionato) copper(II), cupric acetylacetonate, Cu(acac)2, CAS# 13395-16-9