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Cu Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Cu films returned 17 record(s).

NumberTitle
1Hydrogen plasma-enhanced atomic layer deposition of copper thin films
2Low temperature hydrogen plasma-assisted atomic layer deposition of copper studied using in situ infrared reflection absorption spectroscopy
3Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
4Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
5Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
6Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer
7Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides
8Copper-ALD Seed Layer as an Enabler for Device Scaling
9Island Coalescence during Film Growth: An Underestimated Limitation of Cu ALD
10Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
11Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
12Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
13PEALD of Copper using New Precursors for Next Generation of Interconnections
14Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
15Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
16Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
17Deposition of copper by plasma-enhanced atomic layer deposition using a novel N-Heterocyclic carbene precursor