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Cu Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Cu films returned 17 record(s).

Number	Title
1	Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
2	Island Coalescence during Film Growth: An Underestimated Limitation of Cu ALD
3	Low temperature hydrogen plasma-assisted atomic layer deposition of copper studied using in situ infrared reflection absorption spectroscopy
4	Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
5	Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
6	PEALD of Copper using New Precursors for Next Generation of Interconnections
7	Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
8	Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
9	Copper-ALD Seed Layer as an Enabler for Device Scaling
10	Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides
11	Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
12	Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
13	Deposition of copper by plasma-enhanced atomic layer deposition using a novel N-Heterocyclic carbene precursor
14	Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
15	Plasma-enhanced atomic layer deposition of Cuâ€“Mn films with formation of a MnSi_xO_y barrier layer
16	Hydrogen plasma-enhanced atomic layer deposition of copper thin films
17	Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD