Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
Info:
Chem. Mater. 2015, 27, 5988-5996
Author Information
Films
Film/Plasma Properties
Analysis: XRR, X-Ray Reflectivity
Analysis: SEM, Scanning Electron Microscopy
Analysis: SEM, Scanning Electron Microscopy
Analysis: SEM, Scanning Electron Microscopy
Analysis: XPS, X-ray Photoelectron Spectroscopy
Analysis: AFM, Atomic Force Microscopy
Analysis: Four-point Probe
Analysis: QCM, Quartz Crystal Microbalance
Analysis: OES, Optical Emission Spectroscopy
Analysis: TEM, Transmission Electron Microscope
Analysis: Electron Diffraction
Substrates
Notes