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Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors

Type:
Journal
Info:
Advanced Engineering Materials Volume 19, Issue 2, February 2017
Date:
2016-10-17
DOI:
http://dx.doi.org/10.1002/adem.201600593

Author Information

Name Institution
Alexander SasinskaUniversity of Cologne
Daniel RitschelUniversity of Cologne
Lisa CzympielUniversity of Cologne
Sanjay MathurUniversity of Cologne

Films

Plasma Cu

Hardware used: Unknown
[Cu((Py)CHCOCF3)2]2
CAS#: 0-0-0
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Diagnostic: -

Characteristic: Resistivity, Sheet Resistance
Analysis: -
Diagnostic: -

Substrates

Notes

950