About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Non-destructive acoustic metrology and void detection in 3x50μm TSV

Type:
Conference Proceedings
Info:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Date:
2016-05-16
DOI:
http://dx.doi.org/10.1109/ASMC.2016.7491103

Author Information

Name Institution
R. MairRudolph Technologies
M. KotelyanskiiRudolph Technologies
M. MehendaleRudolph Technologies
X. RuRudolph Technologies
P. MukundhanRudolph Technologies
T. KrymanRudolph Technologies
M. LiebensIMEC
S. Van HuylenbroeckIMEC
L. HaenselIMEC
A. MillerIMEC
E. BeyneIMEC
T. MurrayUniversity of Colorado, Boulder

Films

Plasma SiO2

Hardware used: Unknown
Deposition Temperature Range N/A

Thermal TiN

Hardware used: Unknown
Deposition Temperature Range N/A

Thermal Ru

Hardware used: Unknown
Deposition Temperature Range N/A

Film/Plasma Properties

Substrates

Notes

SiO2 is a guess at the "highly conformal Plasma Enhanced Atomic Layer Deposition (PEALD) oxide liner."
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